Search Results - "Plossl, A."

High brightness LEDs for general lighting applications Using the new ThinGaN™‐Technology by Haerle, V., Hahn, B., Kaiser, S., Weimar, A., Bader, S., Eberhard, F., Plössl, A., Eisert, D.

“…During the last years GaN‐technology has proven to fulfill the requirements of solid state lighting. Lighting requirements are mainly driven by brightness,…”
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Wafer direct bonding: tailoring adhesion between brittle materials by Plößl, Andreas, Kräuter, Gertrud

“…It is a well-known phenomenon that two solids with sufficiently flat surfaces can stick to each other when brought into intimate contact in ambient air at room…”
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The novel CaMKII inhibitor GS-680 reduces diastolic SR Ca leak and prevents CaMKII-dependent pro-arrhythmic activity by Lebek, S., Plößl, A., Baier, M., Mustroph, J., Tarnowski, D., Lücht, C.M., Schopka, S., Flörchinger, B., Schmid, C., Zausig, Y., Pagratis, N., Marchand, B., Koltun, D.O., Hung, W.K., Ahmadyar, S., Belardinelli, L., Maier, L.S., Wagner, S.

“…Ca/calmodulin-dependent protein kinase II (CaMKII) was shown to increase diastolic sarcoplasmic reticulum (SR) Ca leak, which can result in delayed…”
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Endurance exercise improves walking distance in MS patients with fatigue by Dettmers, C., Sulzmann, M., Ruchay-Plössl, A., Gütler, R., Vieten, M.

“…Objectives –  Effects of endurance training in multiple sclerosis (MS) patients complaining of motor fatigue. Materials and methods –  Thirty MS patients…”
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High-efficiency red and infrared light-emitting diodes using radial outcoupling taper by Schmid, W., Scherer, M., Karnutsch, C., Plossl, A., Wegleiter, W., Schad, S.-S., Neubert, B., Streubel, K.

“…In this paper, we give an overview of light-emitting diodes (LEDs) with radial tapers. Light is generated in the very center of a circularly symmetrical…”
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Wafer bonding for microsystems technologies by Gösele, U., Tong, Q.-Y., Schumacher, A., Kräuter, G., Reiche, M., Plößl, A., Kopperschmidt, P., Lee, T.-H., Kim, W.-J.

“…In microsystems technologies, frequently complex structures consisting of structured or plain silicon or other wafers have to be joined to one mechanically…”
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Large-area wafer bonding of GaAs using hydrogen and ultrahigh vacuum atmospheres by KÄSTNER, G, AKATSU, T, SENZ, S, PLÖSSL, A, GÖSELE, U

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InGaN on SiC LEDs for High Flux and High Current Applications by Baur, J., Hahn, B., Fehrer, M., Eisert, D., Stein, W., Plössl, A., Kühn, F., Zull, H., Winter, M., Härle, V.

“…We investigate the influence of chip size, substrate shaping and mounting techniques on the light extraction efficiency of large area InGaN‐LED chips grown on…”
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High brightness LEDs for general lighting applications Using the new ThinGaN™-Technology by Haerle, V., Hahn, B., Kaiser, S., Weimar, A., Bader, S., Eberhard, F., Plössl, A., Eisert, D.

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Silicon-on-insulator: materials aspects and applications by Ploessl, Andreas, Kraeuter, Gertrud

“…The purpose of this contribution is to give an overview of silicon-on-insulator (SOI) technology with emphasis on the fabrication of SOI substrates and their…”
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Growth of partially strain-relaxed Si1-yCy epilayers on (100)Si by SENZ, S, PLÖSSL, A, GÖSELE, U, ZERLAUTH, S, STANGL, J, BAUER, G

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Growth of partially strain-relaxed Si 1-y C y epilayers on (100)Si by Senz, S., Plössl, A., Gösele, U., Zerlauth, S., Stangl, J., Bauer, G.

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High brightness LEDs for general lighting applications Using the new ThinGaNTM-Technology by Haerle, V, Hahn, B, Kaiser, S, Weimar, A, Bader, S, Eberhard, F, Plossl, A, Eisert, D

“…During the last years GaN-technology has proven to fulfill the requirements of solid state lighting. Lighting requirements are mainly driven by brightness,…”
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Twisted substrate goes universal by Piößl, Andreas

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Wafer bonding: a flexible approach to materials integration by Gosele, U., Kastner, G., Senz, S., Kopperschmidt, P., Plossl, A., Scholz, R., Tong, Q.-Y., Chao, Y.-L., Huang, L.-J.

“…"Wafer bonding" refers to the phenomenon that mirror-polished, flat and clean surfaces of almost any material, when brought into contact at room temperature,…”
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