Search Results - "Plas, Geert Van der"
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Climate-human-landscape interaction in the eastern foothills of Mt. Kilimanjaro (equatorial East Africa) during the last two millennia
Published in Holocene (Sevenoaks) (01-04-2021)“…The Mt. Kilimanjaro region is known for its long history of intensive agriculture, but the temporal extent of human activity and its impact on the regional…”
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Factor Analysis of Plasma-Induced Damage in Bulk FinFET Technology
Published in IEEE electron device letters (01-07-2018)“…In this letter, factor analysis is employed to investigate the hidden dependencies and correlations of plasma-induced damage with other FEOL and BEOL…”
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On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing
Published in Microelectronic engineering (01-06-2013)“…Barrier reliability in 3D through-Si via (TSV) Cu interconnections requires particular attention as these structures come very close to the active devices and…”
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A 150 MS/s 133 μW 7 bit ADC in 90 nm Digital CMOS
Published in IEEE journal of solid-state circuits (01-12-2008)Get full text
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Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-03-2021)“…In this article, we design, demonstrate, and characterize a 3-D printed package-level polymer jet impingement cooling solution on a <inline-formula> <tex-math…”
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Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement
Published in Fluids (Basel) (01-03-2024)“…With ever increasing integration density of electronic components, the demand for cooling solutions capable of removing the heat generated by such systems…”
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A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a
Published in IEEE journal of solid-state circuits (01-12-2007)“…We propose an all-digital UWB transmitter architecture that exploits the low duty cycle of impulse-radio UWB to achieve ultra-low power consumption. The design…”
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Substrate Noise Coupling Mechanisms in Lightly Doped CMOS Transistors
Published in IEEE transactions on instrumentation and measurement (01-06-2010)“…Substrate noise issues are a showstopper for the smooth integration of analog and digital circuitries on the same die. For the designer, it is not known how…”
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9
A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication
Published in IEEE journal of solid-state circuits (01-11-2007)“…A low-power impulse-radio ultra-wideband receiver is demonstrated for low data-rate applications. A topology selection study demonstrates that the quadrature…”
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Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-06-2014)“…Silicon substrates can be strategically isolated or unified among tiers in a through-silicon-via (TSV)-based 3-D integrated circuit (IC) structure, for the…”
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A Single-Bit 500 kHz-10 MHz Multimode Power-Performance Scalable 83-to-67 dB DR CTΔΣ for SDR in 90 nm Digital CMOS
Published in IEEE journal of solid-state circuits (01-06-2010)“…Wireless environments, high data rates and increased digitization require A/D converters with high dynamic range and large bandwidth at the lowest possible…”
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A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a
Published in 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (01-02-2007)“…A digital UWB TX that supports the IEEE 802.15.4a standard is presented. A digitally controlled oscillator produces the RF carrier for all bands between 3 and…”
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Conference Proceeding -
13
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…This paper presents a novel approach for extreme wafer thinning on carrier followed by nano-scale via-last formation in order to achieve sub-500nm pitch…”
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Conference Proceeding -
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Modeling of Substrate Noise Generation, Isolation, and Impact for an LC-VCO and a Digital Modem on a Lightly-Doped Substrate
Published in IEEE journal of solid-state circuits (01-09-2006)“…Substrate noise generated by the digital circuits on a mixed-signal IC can severely disturb the analog and RF circuits sharing the same substrate. Simulations…”
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15
A fast start-up 3GHz-10GHz digitally controlled oscillator for UWB impulse radio in 90nm CMOS
Published in ESSCIRC 2007 - 33rd European Solid-State Circuits Conference (01-09-2007)“…A digitally controlled ring oscillator, key component of a UWB transceiver, is presented. The design supports the IEEE 802.15.4 standard for which all bands…”
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Conference Proceeding -
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Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and \mu TSVs
Published in IEEE transactions on electron devices (01-01-2020)“…In this article, a power delivery network (PDN) modeling framework for backside-PDN configurations is presented. A backside-PDN configuration contains dense…”
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Determinants of savanna-fire dynamics in the eastern Lake Victoria catchment (western Kenya) during the last 1200 years
Published in Quaternary international (20-09-2018)“…In tropical ecosystems, climate and human impact are generally considered the main determinants of savanna fire distribution, but their relative roles in…”
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Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects
Published in IEEE transactions on microwave theory and techniques (01-04-2020)“…This article presents a full-wave method to characterize lossy conductors in an interconnect setting. To this end, a novel and accurate differential surface…”
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Efficient Backside Power Delivery for High-Performance Computing Systems
Published in IEEE transactions on very large scale integration (VLSI) systems (01-11-2022)“…In this work, we present a thin-profile, efficient power delivery approach, including a voltage regulator with in-package power inductor and backside power…”
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Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies
Published in IEEE transactions on microwave theory and techniques (01-07-2023)“…In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a…”
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