Search Results - "Plas, Geert Van der"

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  1. 1

    Climate-human-landscape interaction in the eastern foothills of Mt. Kilimanjaro (equatorial East Africa) during the last two millennia by van der Plas, Geert W, Rucina, Stephen M, Hemp, Andreas, Marchant, Robert A, Hooghiemstra, Henry, Schüler, Lisa, Verschuren, Dirk

    Published in Holocene (Sevenoaks) (01-04-2021)
    “…The Mt. Kilimanjaro region is known for its long history of intensive agriculture, but the temporal extent of human activity and its impact on the regional…”
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    Journal Article
  2. 2

    Factor Analysis of Plasma-Induced Damage in Bulk FinFET Technology by Hiblot, Gaspard, Van der Plas, Geert

    Published in IEEE electron device letters (01-07-2018)
    “…In this letter, factor analysis is employed to investigate the hidden dependencies and correlations of plasma-induced damage with other FEOL and BEOL…”
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    Journal Article
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    Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement by Elsinger, Georg, Oprins, Herman, Cherman, Vladimir, Van der Plas, Geert, Beyne, Eric, De Wolf, Ingrid

    Published in Fluids (Basel) (01-03-2024)
    “…With ever increasing integration density of electronic components, the demand for cooling solutions capable of removing the heat generated by such systems…”
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    Journal Article
  7. 7

    A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a by Ryckaert, J., Van der Plas, G., De Heyn, V., Desset, C., Van Poucke, B., Craninckx, J.

    Published in IEEE journal of solid-state circuits (01-12-2007)
    “…We propose an all-digital UWB transmitter architecture that exploits the low duty cycle of impulse-radio UWB to achieve ultra-low power consumption. The design…”
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    Journal Article Conference Proceeding
  8. 8

    Substrate Noise Coupling Mechanisms in Lightly Doped CMOS Transistors by Bronckers, Stephane, Van der Plas, Geert, Vandersteen, Gerd, Rolain, Yves

    “…Substrate noise issues are a showstopper for the smooth integration of analog and digital circuitries on the same die. For the designer, it is not known how…”
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    Journal Article
  9. 9

    A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication by Ryckaert, J., Verhelst, M., Badaroglu, M., D'Amico, S., De Heyn, V., Desset, C., Nuzzo, P., Van Poucke, B., Wambacq, P., Baschirotto, A., Dehaene, W., Van der Plas, G.

    Published in IEEE journal of solid-state circuits (01-11-2007)
    “…A low-power impulse-radio ultra-wideband receiver is demonstrated for low data-rate applications. A topology selection study demonstrates that the quadrature…”
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    Journal Article
  10. 10

    Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits by Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Marchal, Paul, Libois, Michael, La Manna, Antonio, Wenqi Zhang, Beyer, Gerald, Beyne, Eric

    “…Silicon substrates can be strategically isolated or unified among tiers in a through-silicon-via (TSV)-based 3-D integrated circuit (IC) structure, for the…”
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    Journal Article
  11. 11

    A Single-Bit 500 kHz-10 MHz Multimode Power-Performance Scalable 83-to-67 dB DR CTΔΣ for SDR in 90 nm Digital CMOS by Crombez, Pieter, Van der Plas, Geert, Steyaert, Michiel S J, Craninckx, Jan

    Published in IEEE journal of solid-state circuits (01-06-2010)
    “…Wireless environments, high data rates and increased digitization require A/D converters with high dynamic range and large bandwidth at the lowest possible…”
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    Journal Article
  12. 12

    A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a by Ryckaert, Julien, van der Plas, Geert, de Heyn, Vincent, Desset, Claude, Vanwijnsberghe, Geert, van Poucke, Bart, Craninckx, Jan

    “…A digital UWB TX that supports the IEEE 802.15.4a standard is presented. A digitally controlled oscillator produces the RF carrier for all bands between 3 and…”
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    Conference Proceeding
  13. 13

    Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration by Jourdain, Anne, Schleicher, Filip, De Vos, Joeri, Stucchi, Michele, Chery, Emmanuel, Miller, Andy, Beyer, Gerald, Van der Plas, Geert, Walsby, Edward, Roberts, Kerry, Ashraf, Huma, Thomas, Dave, Beyne, Eric

    “…This paper presents a novel approach for extreme wafer thinning on carrier followed by nano-scale via-last formation in order to achieve sub-500nm pitch…”
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    Conference Proceeding
  14. 14

    Modeling of Substrate Noise Generation, Isolation, and Impact for an LC-VCO and a Digital Modem on a Lightly-Doped Substrate by Soens, C., Van der Plas, G., Badaroglu, M., Wambacq, P., Donnay, S., Rolain, Y., Kuijk, M.

    Published in IEEE journal of solid-state circuits (01-09-2006)
    “…Substrate noise generated by the digital circuits on a mixed-signal IC can severely disturb the analog and RF circuits sharing the same substrate. Simulations…”
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    Journal Article
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    A fast start-up 3GHz-10GHz digitally controlled oscillator for UWB impulse radio in 90nm CMOS by De Heyn, V., Van der Plas, G., Ryckaert, J., Craninckx, J.

    “…A digitally controlled ring oscillator, key component of a UWB transceiver, is presented. The design supports the IEEE 802.15.4 standard for which all bands…”
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    Conference Proceeding
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    Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and \mu TSVs by Hossen, Md Obaidul, Chava, Bharani, Van der Plas, Geert, Beyne, Eric, Bakir, Muhannad S.

    Published in IEEE transactions on electron devices (01-01-2020)
    “…In this article, a power delivery network (PDN) modeling framework for backside-PDN configurations is presented. A backside-PDN configuration contains dense…”
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    Journal Article
  17. 17

    Determinants of savanna-fire dynamics in the eastern Lake Victoria catchment (western Kenya) during the last 1200 years by Colombaroli, Daniele, van der Plas, Geert, Rucina, Stephen, Verschuren, Dirk

    Published in Quaternary international (20-09-2018)
    “…In tropical ecosystems, climate and human impact are generally considered the main determinants of savanna fire distribution, but their relative roles in…”
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    Journal Article
  18. 18

    Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects by Huynen, Martijn, Kapusuz, Kamil Yavuz, Sun, Xiao, Van der Plas, Geert, Beyne, Eric, De Zutter, Daniel, Vande Ginste, Dries

    “…This article presents a full-wave method to characterize lossy conductors in an interconnect setting. To this end, a novel and accurate differential surface…”
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    Journal Article
  19. 19

    Efficient Backside Power Delivery for High-Performance Computing Systems by Lin, Hesheng, van der Plas, Geert, Sun, Xiao, Velenis, Dimitrios, Catthoor, Francky, Lauwereins, Rudy, Beyne, Eric

    “…In this work, we present a thin-profile, efficient power delivery approach, including a voltage regulator with in-package power inductor and backside power…”
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    Journal Article
  20. 20

    Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies by Bosman, Dries, Huynen, Martijn, De Zutter, Daniel, Sun, Xiao, Pantano, Nicolas, Van der Plas, Geert, Beyne, Eric, Vande Ginste, Dries

    “…In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a…”
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    Journal Article