Search Results - "Plano, Bernard"
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1
Generation of metal composition gradients by means of bipolar electrodeposition
Published in Electrochimica acta (10-10-2015)“…[Display omitted] •A bipolar electrochemistry approach for the preparation of surface gradients is reported.•Several metals are simultaneously deposited on a…”
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Journal Article -
2
Love Acoustic Wave-Based Devices and Molecularly-Imprinted Polymers as Versatile Sensors for Electronic Nose or Tongue for Cancer Monitoring
Published in Sensors (Basel, Switzerland) (20-06-2016)“…Cancer is a leading cause of death worldwide and actual analytical techniques are restrictive in detecting it. Thus, there is still a challenge, as well as a…”
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3
Integration of PZT thick films on additively manufactured substrates for vibrational energy harvesting applications
Published in Journal of intelligent material systems and structures (25-09-2024)“…This work aims to integrate screen-printed thick film (50–100 µm) Pb(Zr,Ti)O 3 (PZT) on additively manufactured stainless steel substrates for vibration energy…”
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4
Importance and Requirement of frequency band specific RF probes EM Models in sub-THz and THz Measurements up to 500 GHz
Published in IEEE transactions on terahertz science and technology (01-09-2020)“…In this paper, we present on-silicon structures on-wafer measurements up to 500 GHz and a comprehensive electromagnetic (EM) simulation analysis to understand…”
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Journal Article -
5
Low temperature spark plasma sintering of efficient (K,Na)NbO3 ceramics
Published in Journal of the European Ceramic Society (01-06-2024)“…This study investigates the sintering optimization and characterization of (K0.5,Na0.5)NbO3 (KNN) ceramics using spark plasma sintering (SPS) at low…”
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6
Comparison of On-Wafer TRL Calibration to ISS SOLT Calibration With Open-Short De-Embedding up to 500 GHz
Published in IEEE transactions on terahertz science and technology (01-01-2019)“…Sub-mm circuit design requires accurate on-wafer characterization of passive and active devices. In industry, characterization of these devices is often…”
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Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test
Published in Microelectronics and reliability (01-09-2023)Get full text
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8
Electro- and thermomigration induced Cu sub(3)Sn and Cu sub(6)Sn sub(5) formation in SnAg sub(3.0)Cu sub(0.5) bumps
Published in Microelectronics and reliability (01-01-2015)“…Two important trends in the microelectronics business are the development of three dimensional packaging solutions which increase the number electronics…”
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9
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps
Published in Microelectronics and reliability (01-01-2015)“…•AC stress tests on SnAgCu bumps on Cu contact pads.•Long- and short-term investigation of the Cu3Sn and Cu6Sn5 formation.•Material parameters for the modeling…”
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10
Electro‐mechanical properties of inkjet‐printed graphene oxide nanosheets
Published in Physica status solidi. A, Applications and materials science (01-03-2017)“…This study deals with the deposition of graphene oxide (G‐O) thin films by inkjet printing method on Love wave devices, forming up G‐O nanosheets in between…”
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11
Improved performances of polymer-based dielectric by using inorganic/organic core-shell nanoparticles
Published in Applied physics letters (01-10-2012)“…BaTiO3/hyperbranched polyester/methacrylate core-shell nanoparticles were studied by varying the shell thickness and the methacrylate ratio. We demonstrated…”
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12
Site Selective Generation of Sol–Gel Deposits in Layered Bimetallic Macroporous Electrode Architectures
Published in Langmuir (07-02-2012)“…The elaboration of an original composite bimetallic macroporous electrode containing a site-selective sol–gel deposit is reported. Regular colloidal crystals,…”
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13
Synthesis of imprinted hydrogel microbeads by inverse Pickering emulsion to controlled release of adenosine 5′‑monophosphate
Published in Materials Science & Engineering C (01-08-2019)“…Herein, we propose the synthesis of a microspherical imprinted hydrogel meant for the controlled release of a nucleotide, adenosine 5′-monophosphate (5′-AMP)…”
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14
Pushing toward the limits of acceleration: Example on wire-bond assemblies
Published in Microelectronics and reliability (01-09-2012)“…In harsh environments, materials are used at their strength limits, and it might be difficult to accelerate the ageing in reliability tests without modifying…”
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Journal Article Conference Proceeding -
15
Investigation of different thermomechanical behaviours in one batch of QFN packages
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07-04-2024)“…This paper investigates the influence of the position of the QFN packages during manufacturing on their mechanical behaviour. The samples under test are…”
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Conference Proceeding -
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Impact of on-Silicon De-Embedding Test Structures and RF Probes Design in the Sub-THz Range
Published in 2018 48th European Microwave Conference (EuMC) (01-09-2018)“…In this paper, we present on-wafer TRL calibration results up to 220 GHz using on-wafer fabricated test structures on the silicon substrate. For on-wafer TRL…”
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Conference Proceeding -
17
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations
Published in Microelectronics and reliability (01-07-2003)“…Very low failure rates, down to 10 FITs (one FIT is equivalent to one failure per 10 9 h × component), are now currently expected for electronics devices. To…”
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A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability
Published in 2013 24th EAEEIE Annual Conference (EAEEIE 2013) (01-05-2013)“…The course "Microelectronic assemblies: from packaging to reliability" is a one-week-course module within the Euro-dots program proposed at the IMS Laboratory,…”
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Conference Proceeding -
19
Structural analysis of integrated circuits using scanning laser ultrasonics
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)“…We present an analysis of a VLSI Circuit using the picosecond ultrasonics technique. This optical non-destructive technique is based on ultrasound generation…”
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Conference Proceeding -
20
Assessment of Constitutive Properties of Solder Materials Used in Surface-Mount Devices for Harsh Environment Applications
Published in IEEE transactions on device and materials reliability (01-09-2015)“…To perform a thermomechanical simulation of surface-mount devices (SMD), relevant solder constitutive properties are needed. This paper reviews some promising…”
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