Search Results - "Plach, Thomas"

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage by Iacovo, Serena, D'have, Koen, Okudur, Oguzhan Orkut, De Vos, Joeri, Uhrmann, Thomas, Plach, Thomas, Conard, Thierry, Meersschaut, Johan, Bex, Pieter, Brems, Steven, Phommahaxay, Alain, Gonzalez, Mario, Witters, Liesbeth, Beyer, Gerald, Beyne, Eric

“…Wafer to wafer bonding studies were carried out on blanket and patterned highly warped wafers using SiCN as bonding dielectric material to gain a deeper…”
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Dielectric Function of Undoped and Doped Poly[2-methoxy-5-(3′,7′-dimethyloctyloxy)-1,4-phenylene-vinylene] by Ellipsometry in a Wide Spectral Range by Gasiorowski, Jacek, Hingerl, Kurt, Menon, Reghu, Plach, Thomas, Neugebauer, Helmut, Wiesauer, Karin, Yumusak, Cigdem, Sariciftci, Niyazi S

“…Ellipsometric measurements in a wide spectral range (from 0.05 to 6.5 eV) have been carried out on the organic semiconducting polymer,…”
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Influencing factors in high precision fusion wafer bonding for monolithic integration by Uhrmann, Thomas, Kurz, Florian, Plach, Thomas, Wagenleitner, Thomas, Dragoi, Viorel, Wimplinger, Markus, Lindner, Paul

“…Both fusion and hybrid wafer bonding are enabling increasing integration density as well as advanced device integration strategies. In any case, wafer-to-wafer…”
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Multiphysics Overlay Modelling of Monolithic 3D Fusion and Hybrid Bonding Processes by Muhlstatter, Christian, Koller, Lukas, Plach, Thomas, Dragoi, Viorel, Wimplinger, Markus

“…Fusion and hybrid wafer-to-wafer bonding are key enabling processes for device scaling and wafer level packaging. Shrinking technology nodes combined with…”
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Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches by Abadie, Karine, Mendes, Ivanie, Pourteau, Marie-Line, Fournel, Frank, Hijazi, Hadi, Balan, Viorel, van Haren, Richard, Li, Suwen, Minghetti, Blandine, van Dijk, Leon, Baars, Mart, Michaud, Laurent, Plach, Thomas, Probst, Gernot

“…With the development of the Back-Side Power Delivery Network (BSPDN), new challenges and specifications in terms of alignment for subsequent exposure steps…”
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Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers by Kang, Shuo, Iacovo, Serena, D'have, Koen, Huylenbroeck, Stefaan Van, Orkut Okudur, Oguzhan, Alexeev, Anton, Plach, Thomas, Probst, Gernot, Ding, Taotao, Wimplinger, Markus, Uhrmann, Thomas, Vos, Joeri De, Beyer, Gerald, Beyne, Eric

“…With the trend of contact pitch scaling down, tight wafer-to-wafer overlay control is required to ensure device electrical yield performance in hybrid bonding…”
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