Search Results - "Pi, Bensong"
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Analysis of lattice deformation originated from residual stress on performance of aluminum nitride-based bulk acoustic wave resonators
Published in Composite structures (15-07-2024)“…With the development of MEMS technology to the nanometer scale, the influence of different process conditions on the performance of nano-devices can be…”
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Journal Article -
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Analysis the interface delamination of Cu and EMC adhesive material in the cutting process of electronic chip based on cohesive zone modeling
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01-08-2016)“…In this paper, cohesive zone modeling (CZM) was adopted to simulate the distribution of temperature & stress field and the interface damage on the Cu/EMC…”
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Conference Proceeding -
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Thermal conductivity of epoxy resin using molecular dynamics simulation
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01-08-2018)“…The low thermal conductivity of amorphous epoxy resin significantly limits its applications in electronics. In this paper, the thermal conductivity of…”
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Conference Proceeding -
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