Search Results - "Pernel, C."

Electrochemical behaviour of americium ions in LiCl–KCl eutectic melt by Serp, J., Chamelot, P., Fourcaudot, S., Konings, R.J.M., Malmbeck, R., Pernel, C., Poignet, J.C., Rebizant, J., Glatz, J.-P.

“…This work presents a study on the electrochemical properties of AmCl 3 in a molten LiCl–KCl eutectic, at a temperature range of 733–833 K. Transient…”
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Electrochemical behavior of copper and cobalt in post-etch cleaning solutions by Bilouk, S., Broussous, L., Nogueira, R.P., Ivanova, V., Pernel, C.

“…Cleaning is one of the key steps of the integration of self aligned barriers (SAB) in microelectronic devices for 32 nm technology and below. It is hence…”
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Wet process optimization to deposit conformal Cu diffusion barrier into TSV by Pernel, C., Avale, X., Veillerot, M., Hortemel, L., Leduc, P., Ritzdorf, T.

“…This paper reports the use of SAM (Self Assembled Monolayer) formation to deposit the copper diffusion barrier into high aspect ratio TSV. SEM, AFM, water…”
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