Search Results - "Peng, Chongnan"
-
1
The fabrication of rod-like and hierarchical ZnO nanomaterials by a simple and controllable method
Published in Materials science in semiconductor processing (01-02-2014)“…Rod-like and hierarchical ZnO nanomaterials were fabricated via a single-step refluxing route in water–methanol mixed solution without any surfactant or…”
Get full text
Journal Article -
2
Investigation of the optical properties of ZnO/epoxy resin nanocomposite: Application in the LED
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01-08-2012)“…With development of high-power white light LED, people pay more attention to the reliability and security of packaging materials. Epoxy resins, as a main…”
Get full text
Conference Proceeding
-
3
Different morphologies of nano-ZnO affection on properties of transparent epoxy resin encapsulants
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01-12-2012)“…With the development of light emitting diodes (LEDs), it puts forward higher performance requirements on encapsulants, mainly epoxy resins. So far, people have…”
Get full text
Conference Proceeding -
4
Investigation on the properties and processability of polymeric insulation layers for through silicon via
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01-05-2013)“…3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. In this paper, the TSV process uses a polymeric liner…”
Get full text
Conference Proceeding -
5
Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07-04-2024)“…Laser drilling has gained widespread popularity in industrial applications due to its precision, non-contact nature, speed, efficiency, and energy-saving…”
Get full text
Conference Proceeding -
6
Characterization and modeling of a typical curing material for photoresist films
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25-04-2022)“…The photo imaging process is one of the most important advances in the production of printed circuit boards (PCBs). Especially, UV-curable resins are widely…”
Get full text
Conference Proceeding