Search Results - "Paxton, B.H."

Creep in chipboard [timber products]. 2. The use of fitted response curves for comparative and predictive purposes by Pierce, C.B, Dinwoodie, J.M, Paxton, B.H

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Fatigue and creep in chipboard: Part 2. The influence of slow cyclic fatigue on the creep behaviour of chipboard at a range of stress levels and moisture contents by Dinwoodie, J.M., Paxton, B.H., Bonfield, P.W., Mundy, J.S.

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Modelling the creep behavior of chipboard: the rheological approach by Mundy, J.S, Bonfield, P.W, Dinwoodie, J.M, Paxton, B.H

“…The process of applying the rheological approach to describe creep deformation has been investigated using the 5-parameter model developed by Pierce and…”
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Fatigue and creep in chipboard. 2. The influence of slow cyclic fatigue on the creep behaviour of chipboard at a range of stress levels and moisture contents by Dinwoodie, J.M, Paxton, B.H, Bonfield, P.W, Mundy, J.S

“…Matched samples of chipboard were loaded in four-point bending under either a 7 hours loaded/17 hours unloaded cycle, a 17 hours loaded/7 unloaded cycle, or…”
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Creep in chipboard: Part 8: The effect of steady-state moisture content, temperature and level of stressing on the relative creep behaviour and creep modulus of a range of boards by Dinwoodie, J.M., Robson, D.J., Paxton, B.H., Higgins, J.S.

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Creep in chipboard: Part 10: The effect of variable climate on the creep behaviour of a range of chipboards and one waferboard by Dinwoodie, J.M., Paxton, B.H., Higgins, Jo-Anne, Robson, D.J.

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Creep in chipboard: Part 11: The effect of cyclic changes in moisture content and temperature on the creep behaviour of a range of boards at different levels of stressing by Dinwoodie, J.M., Higgins, Jo-Anne, Paxton, B.H., Robson, D.J.

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Creep in chipboard. 11. The effect of cyclic changes in moisture content and temperature on the creep behaviour of a range of boards at different levels of stressing by Dinwoodie, J.M, Higgins, J.A, Paxton, B.H, Robson, D.J

“…Matched samples to those used in a previously reported investigation (under constant environments employing eight board materials and solid wood) were…”
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Creep in chipboard. 8. The effect of steady-state moisture content, temperature and level of stressing on the relative creep behaviour and creep modulus of a range of boards by Dinwoodie, J.M. (Building Research Establishment, Watford), Robson, D.J, Paxton, B.H, Higgins, J.S

“…Deflection under 4-point bending of a range of board types was measured for up to six months. Results were obtained under steady-state conditions of stress…”
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Creep in chipboard: Part 9: The effect of steady-state moisture content, temperature and level of stressing on the components of creep deflection for a range of boards by Dinwoodie, J.M., Higgins, J.-A., Paxton, B.H., Robson, D.J.

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Creep in chipboard. 10. The effect of variable climate on the creep behaviour of a range of chipboards and one waferboard by Dinwoodie, J.M. (Building Research Establishment, Watford), Paxton, B.H, Higgins, J.S, Robson, D.J

“…Ten samples from each of ten brands of commercial chipboard, covering a range of UF, MUF and PF resins, were stressed over a 5-year period at 30% of their…”
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Creep in chipboard: Part 7: Testing the efficacy of models on 7?10 years data and evaluating optimum period of prediction by Dinwoodie, J.M.W., Higgins, J.-A., Robson, D.J., Paxton, B.H.

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Creep in chipboard. 9. The effect of steady-state moisture content, temperature and level of stressing on the components of creep deflection for a range of boards by Dinwoodie, J.M. (Building Research Establishment, Watford), Higgins, J.A, Paxton, B.H, Robson, D.J

“…Simples of five chipboards, one waferboard, one plywood, one fibre building board and redwood timber (Pinus sylvestris) were loaded in 4-point bending under…”
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Creep in chipboard. 5. An improved model for prediction of creep deflection by Pierce, C.B, Dinwoodie, J.M, Paxton, B.H

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Creep in chipboard. 4. The influence of temperature and moisture content on the creep behaviour of a range of boards at a single stress level by Dinwoodie J.M.W, Pierce C.B, Paxton B.H

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Creep in chipboard. 7. Testing the efficacy of models on 7-10 years data and evaluating optimum period of prediction by Dinwoodie J.M.W, Higgins J.A, Robson D.J, Paxton B.H

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Creep in chipboard. 6. Time to failure analysis under steady state conditions by Pierce, C.B, Dinwoodie, J.M, Paxton, B.H

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Creep in chipboard. 3. Initial assessment of the influence of moisture content and level of stressing on rate of creep and time to failure by Dinwoodie J.M, Paxton B.H, Pierce C.B

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Creep research on particleboard. 15 year's work at the UK Building Research Establishment by Dinwoodie, J.M. (Building Research Establishment, Watford (UK). Dept. of Environment), Higgins, J.A, Paxton, B.H, Robson, D.J

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