Search Results - "Pasquariello, Donato"

Surface energy as a function of self-bias voltage in oxygen plasma wafer bonding by Pasquariello, Donato, Lindeberg, Mikael, Hedlund, Christer, Hjort, Klas

“…A limitation in the use of wafer bonding has been the necessity for high-temperature annealing after contacting the wafers at room temperature. In this paper,…”
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Analysis of the Degradation Mechanism during Repeated Overwrite of Phase-Change Discs by Kuiper, A. E. Ton, Pasquariello, Donato, Bulle-Lieuwma, Corrie W. T., Kaiser, Monja, Verheijen, Marcel A., Nulens, Harry A. G., Pieterson, Liesbeth van, Zhong, George J. Y.

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Crystalline Defects in InP-to-Silicon Direct Wafer Bonding by Pasquariello, Donato, Camacho, Martin, Ericsson, Fredric, Hjort, Klas

“…InP-to-Si wafer bonding has been proposed as a way of circumventing the problems associated with lattice-mismatch in heteroepitaxial growth. Therefore, in this…”
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Plasma-assisted InP-to-Si low temperature wafer bonding by Pasquariello, D., Hjort, K.

“…The applicability of wafer bonding as a tool to integrate the dissimilar material system InP-to-Si is presented and discussed with recent examples of InP-based…”
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Selective undercut etching of InGaAs and InGaAsP quantum wells for improved performance of long-wavelength optoelectronic devices by Pasquariello, D., Bjorlin, E.S., Lasaosa, D., Chiu, Yi.-J., Piprek, J., Bowers, J.E.

“…In this paper, the authors show how selective undercut etching of InGaAs and InGaAsP-based quantum wells (QWs) can improve the performance of InP-based…”
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Remote-Touch: A Laser Input User-Display Interaction Technology by Pasquariello, D., Vissenberg, M.C.J.M., Destura, G.J.

“…In this paper, we present a new user-display interaction technology in which a laser-pointer is used to select objects on a display screen. In this interaction…”
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High-Speed 7× CuSi-Based Write-Once Blu-ray Disc by Vullers, Ruud J. M., Kuiper, A. E. Ton, Pasquariello, Donato

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Evaluation of InP-to-silicon heterobonding by Pasquariello, Donato, Camacho, Martin, Hjort, Klas, Dózsa, László, Szentpáli, Béla

“…In this paper, we evaluate hydrophilic (HP) and hydrophobic (HB) surface pre-treatments in InP-to-Si direct wafer bonding. Surface roughness and surface…”
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Optimization of GaAs amplification photodetectors for 700% quantum efficiency by Piprek, J., Lasaosa, D., Pasquariello, D., Bowers, J.E.

“…We investigate the device physics of novel GaAs waveguide photodetectors with integrated photon multiplication. Such detectors have the potential to achieve…”
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InP and Si metal-oxide semiconductor structures fabricated using oxygen plasma assisted wafer bonding by FORSBERG, Markus, PASQUARIELLO, Donato, CAMACHO, Martin, BERGMAN, David

“…InP MOS structures are fabricated by transferring thermally grown SiO2 to InP from oxidized Si wafers using O plasma assisted wafer bonding followed by…”
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Traveling-wave photodetectors with high power-bandwidth and gain-bandwidth product performance by Lasaosa, D., Jin-Wei Shi, Pasquariello, D., Gan, K.-G., Ming-Chun Tien, Hsu-Hao Chang, Shi-Wei Chu, Chi-Kuang Sun, Yi-Jen Chiu, Bowers, J.E.

“…Traveling-wave photodetectors (TWPDs) are an attractive way to simultaneously maximize external quantum efficiency, electrical bandwidth, and maximum…”
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High gain, high efficiency vertical-cavity semiconductor optical amplifiers by Bjorlin, E.S., Abraham, P., Pasquariello, D., Piprek, J., Yi-Jen Chiu, Bowers, J.E.

“…Highly efficient long wavelength vertical-cavity semiconductor optical amplifiers (VCSOAs) are presented. A carrier confining structure was introduced by…”
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Fabrication of tunable InP/air-gap Fabry-Perot cavities by selective etching of InGaAs sacrificial layers by Chitica, Nicolae, Daleiden, Jürgen, Bentell, Jonas, André, Janos, Strassner, Martin, Greek, Staffan, Pasquariello, Donato, Karlsson, Mikael, Gupta, Ram, Hjort, Klas

“…We report the fabrication of InP/air-gap Fabry-Perot resonant cavities with an improved tunability characteristic achieved through the micromachining of more…”
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Low temperature epitaxial layer transferring using oxygen plasma wafer bonding by Pasquariello, D., Camacho, M., Hjort, K.

“…Summary form only given. Although wafer bonding alleviates the mismatch constraint the difference in thermal expansion remains. Consequently the high…”
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