Search Results - "Parlee, M.R."

Manufacturable tri-stack AlSb/INAS HEMT low-noise amplifiers using wafer-level-packaging technology for light-weight and ultralow-power applications by Chou, Y.C., Chang-Chien, P., Yang, J.M., Nishimoto, M.Y., Hennig, K., Lange, M.D., Zeng, X., Parlee, M.R., Lin, C.H., Lee, L.S., Nam, P.S., Wojtowicz, M., Barsky, M.E., Oki, A.K., Boos, J.B., Bennett, B.R., Papanicolaou, N.A.

“…A wafer-level-packaging technology was used to integrate the 0.1 mum AlSb/InAs HEMT low-noise amplifiers with power amplifiers, switches and phase shifters to…”
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Reliability evaluation of hermetic GaAs HEMT MMICs using wafer-scale-assembly technology for compact and light-weight applications by Chou, Y.C., Chang-Chien, P., Leung, D.L., Kono, R.K., Zeng, X., Parlee, M.R., Hennig, K., Eng, D.C., Trucker, C., Tsai, R.S., Wojtowicz, M., Barsky, M.E., Oki, A.K., Block, T.

“…Wafer-scale-assembly (WSA) technology has been developed for compact and light-weight applications at the Northrop Grumman Corporation. To insure successful…”
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