Search Results - "Park, Seong‐Geon"
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Dopant selection rules for desired electronic structure and vacancy formation characteristics of TiO2 resistive memory
Published in Applied physics letters (25-02-2013)“…Doping has often been considered for performance improvement of resistive memories (ReRAM), but the effects of many different dopants have not been…”
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ON-OFF switching mechanism of resistive-random-access-memories based on the formation and disruption of oxygen vacancy conducting channels
Published in Applied physics letters (13-02-2012)“…We study the ON-OFF switching mechanism of oxide-based resistive-random-access-memories using theoretical calculations. Electron deficient vacancies (V O ) up…”
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Material and Structural Engineering of Ovonic Threshold Switch for Highly Reliable Performance
Published in Advanced electronic materials (01-09-2022)“…As a selection device for highly integrated crossbar‐type data storage, the chalcogenide‐based ovonic threshold switch (OTS) shows high selectivity, fast…”
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Generalized mechanism of the resistance switching in binary-oxide-based resistive random-access memories
Published in Physical review. B, Condensed matter and materials physics (08-04-2013)“…We report that V sub(O) cohesion-isolation transition caused by carrier injection/removal is a generalized resistance switching mechanism of binary-oxide-based…”
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Quad-Level Cell Switching with Excellent Reliability in TiN/AlOx:Ti/TaOx/TiN Memory Device
Published in Materials (24-03-2022)“…TiN/AlOx:Ti/TaOx/TiN memory devices using bilayer resistive switching memory demonstrated excellent durability and capability of QLC (quad-level cell) memory…”
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First principles modeling of charged oxygen vacancy filaments in reduced TiO2–implications to the operation of non-volatile memory devices
Published in Mathematical and computer modelling (01-07-2013)“…First principles density functional theory calculations were employed to study the band structure of reduced rutile TiO2 and the implications of oxygen vacancy…”
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A non-linear ReRAM cell with sub-1μA ultralow operating current for high density vertical resistive memory (VRRAM)
Published in 2012 International Electron Devices Meeting (01-12-2012)“…A non-linear RRAM cell with sub-1μA ultralow operating current has been successfully fabricated for high density vertical ReRAM (VRRAM) applications. A uniform…”
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Conference Proceeding -
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Impact of Oxygen Vacancy Ordering on the Formation of a Conductive Filament in \hbox for Resistive Switching Memory
Published in IEEE electron device letters (01-02-2011)“…The electronic properties of rutile TiO 2 with an ordered arrangement of oxygen vacancies show a transition from a resistive to conductive oxide as a function…”
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Electric field dependent switching and degradation of Resistance Random Access Memory
Published in 2009 IEEE International Integrated Reliability Workshop Final Report (01-10-2009)“…We have developed a novel method and model to describe the switching and degradation phenomena of uni-polar type ReRAM using conventional electric field…”
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Conference Proceeding -
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Highly reliable ReRAM technology with encapsulation process for 20nm and beyond
Published in 2013 5th IEEE International Memory Workshop (01-05-2013)“…ReRAM cell performance and reliability have been improved through process optimization. Encapsulated ReRAM cell with SiN capping layer shows excellent…”
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Conference Proceeding -
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First principles calculations of oxygen vacancy-ordering effects in resistance change memory materials incorporating binary transition metal oxides
Published in Journal of materials science (01-11-2012)“…Resistance change random access memories based on transition metal oxides had been recently proposed as promising candidates for the next generation of memory…”
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Effects of Post-Deposition Annealing on the Electrical Properties of HfSiO Films Grown by Atomic Layer Deposition
Published in Japanese Journal of Applied Physics (01-04-2005)“…Post-deposition annealing was investigated for hafnium silicate films deposited on Si substrates by atomic layer deposition. Annealing in NH 3 at 750°C…”
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Material and Structural Engineering of Ovonic Threshold Switch for Highly Reliable Performance (Adv. Electron. Mater. 9/2022)
Published in Advanced electronic materials (01-09-2022)“…OTS Selection Devices Min Kyu Yang, Gun Hwan Kim and co‐workers, in article number 2200161, successfully demonstrate a GeSeTe ovonic threshold switch (OTS)…”
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Impact of Oxygen Vacancy Ordering on the Formation of a Conductive Filament in hbox TiO 2 for Resistive Switching Memory
Published in IEEE electron device letters (01-02-2011)“…The electronic properties of rutile hbox TiO 2 with an ordered arrangement of oxygen vacancies show a transition from a resistive to conductive oxide as a…”
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Impact of Oxygen Vacancy Ordering on the Formation of a Conductive Filament in [Formula Omitted] for Resistive Switching Memory
Published in IEEE electron device letters (01-02-2011)“…The electronic properties of rutile with an ordered arrangement of oxygen vacancies show a transition from a resistive to conductive oxide as a function of…”
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First-principles study of resistance switching in rutile TiO2 with oxygen vacancy
Published in 2008 9th Annual Non-Volatile Memory Technology Symposium (NVMTS) (01-11-2008)“…The electronic properties of defective rutile TiO 2 with oxygen vacancy were studied by ab initio methods to understand resistance switching mechanism for…”
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PBTI & HCI characteristics for high-k gate dielectrics with poly-Si & MIPS (metal inserted poly-Si stack) gates
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)“…Reliability characteristics of high-k gate dielectrics with poly-Si gates and metal inserted poly-Si stack (MIPS) gates are investigated in terms of positive…”
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Breakdown and conduction mechanisms of ALD HfSiON dielectric with TaN gate using carrier separation analysis [MOSFETs]
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)“…For the first time, we evaluated the breakdown and conduction mechanisms of ALD HfSiON with TaN gate. In the unstressed HfSiON, hole current dominates the gate…”
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Conference Proceeding