Search Results - "Park, Sangcheon"

A 64Mpixel CMOS Image Sensor with 0.56μm Unit Pixels Separated by Front Deep-Trench Isolation by Park, Sungbong, Lee, ChangKyu, Park, Sangcheon, Park, Haeyong, Lee, Taeheon, Park, Dami, Heo, Minsung, Park, Inyong, Yeo, Hyunyoung, Lee, Youna, Lee, Juhee, Lee, Beomsuk, Lee, Dong-Chul, Kim, Jinyoung, Kim, Bokwon, Pyo, Jinsun, Quan, Shili, You, Sungyong, Ro, Inho, Choi, Sungsoo, Kim, Sung-In, Joe, In-Sung, Park, Jongeun, Koo, Chang-Hyo, Kim, Jae-Ho, Chang, Chong Kwang, Kim, Taehee, Kim, JinGyun, Lee, Jamie, Kim, Hyunchul, Moon, Chang-rok, Kim, Hyoung-Sub

“…CMOS image sensors (CISs) with deep-submicron pixels are now in high demand, as high-end mobile devices are equipped with multiple camera modules that are used…”
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A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface by Hwang, Bohee, Kim, Sanwi, Lee, Jeonghwan, Lee, Soohwan, Jee, Youngkun, Park, Sangcheon, Jo, Gyeongjae, Kim, Kwangbae, Han, Sungjin, Kim, Ilhwan, Park, Jumyong, Jung, Hyunchul, Kang, Dongwoo, Kang, Un-Byoung

“…Hybrid copper bonding technology (HCB) has been developed to reduce the joint gap of stacked chips to the limit for miniaturization of I/O pitch and high heat…”
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A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology by Lee, Sanghoon, Jee, Youngkun, Park, Sangcheon, Lee, Soohwan, Hwang, Bohee, Jo, Gyeongjae, Lee, Chungsun, Park, Jumyong, Jang, Aeni, Jung, HyunChul, Kim, Ilhwan, Kang, Dongwoo, Baek, Seungduk, Kim, Dae-Woo, Kang, Unbyung

“…Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D…”
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Multi-Robot Path Finding Testbed in Wireless Networks against Malicious Attacks by Park, Sangcheon, Kim, Seunghwan, Cho, Dong-il Dan, Jang, Seohyeong, sung, Jinwoo, Kim, Seong-Lyun

“…Within a decade, a malicious attack aware network design is of critical importance in an internet of things (IoT) network where the attack frequency…”
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