Search Results - "Pandher, R.S."
-
1
Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…The drop shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable…”
Get full text
Conference Proceeding -
2
Spectroscopy, persistent hole burning, and holographic applications of naphtophthalocyanine/haloanthracene systems
Published in Journal of luminescence (01-07-2002)“…We report on the spectroscopic and hole burning properties of free-base naphtophthalocyanine with and without 1-chloranthracene in polymer host. These…”
Get full text
Journal Article Conference Proceeding -
3
Addressing opportunities and risks of pb-free solder alloy alternatives
Published in 2009 European Microelectronics and Packaging Conference (01-06-2009)“…Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen…”
Get full text
Conference Proceeding