Search Results - "Pandey, Shesh Mani"
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An Extrinsic Device and Leakage Mechanism in Advanced Bulk FinFET SRAM
Published in IEEE transactions on very large scale integration (VLSI) systems (01-08-2019)“…A previously unrecognized vertical-extrinsic device in advanced 7-nm FinFET SRAM structures is identified and characterized for the first time. The ON-current…”
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Journal Article -
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Extraction of parasitic and channel resistance components in FinFETs using TCAD tools
Published in Solid-state electronics (01-09-2016)“…•Practical method to extract channel and parasitic resistance in a FinFET device.•Useful guide in designing FinFETs with minimized parasitic…”
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High performance 0.1μm CMOS device with suppressed parasitic junction capacitance and junction leakage current
Published 2002Get full text
Conference Proceeding -
4
Impact of additional LDD rapid thermal annealing on submicron n-MOSFETs
Published in Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI (2003)“…An additional NLDD Rapid Thermal Annealing (RTA) had been implemented in thin-gate and thick-gate NMOS transistors. The threshold voltage (Vt) distribution at…”
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Conference Proceeding -
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Influence of stress induced CT local layout effect (LLE) on 14nm FinFET
Published in 2017 Symposium on VLSI Technology (01-06-2017)“…In this paper, we present a new local layout effect in 14nm FinFET due to different CT layout designs (CT extension, CT spacing, and PC past RX distance)…”
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Conference Proceeding -
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Methodology to achieve planar technology-like ESD performance in FINFET process
Published in 2015 IEEE International Reliability Physics Symposium (01-04-2015)“…Method for making Finfet ESD performance comparable to bulk planar ESD devices is demonstrated using a simple but effective process. Low FIN silicon volume…”
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Conference Proceeding -
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Contact model based on TCAD-experimental interactive algorithm
Published in 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01-09-2015)“…This work demonstrated a novel method utilizing Sentaurus Technology Computer Aided Design simulation along with experiments to intermediately extract Schottky…”
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Conference Proceeding Journal Article -
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Analog, RF, and ESD device challenges and solutions for 14nm FinFET technology and beyond
Published in 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers (01-06-2014)“…Fin-based analog, passive, RF and ESD devices have serious performance challenges, such as poor ideality, higher leakage, low breakdown voltage (BV) of diodes,…”
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Conference Proceeding -
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Impact of STI stress on hot carrier degradation in 5V NMOSFET
Published in 2011 IEEE International Integrated Reliability Workshop Final Report (01-10-2011)“…The effects of shallow trench isolation (STI) induced mechanical stress on hot carrier degradation of 5V NMOSFET with different source(S)/drain(D) areas are…”
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Conference Proceeding -
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Enhanced nFinFET ESD performance
Published in 2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01-09-2017)“…A very simple and useful scheme to enhance the ESD performance of the nFinFET is proposed. By incorporating the N-Well (NW) with the nFinFET, it becomes a low…”
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Conference Proceeding -
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Investigation of performance limiting factors of sub-10nm III-V FinFETs
Published in EUROSOI-ULIS 2015: 2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (01-01-2015)“…As scaling of transistor continues, there is strong impetus to replace Si with attractive alternate channel materials like InGaAs that would provide high…”
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Conference Proceeding