Search Results - "Palisoc, A.L."

Thermal analysis of integrated circuit devices and packages by Lee, C.C., Palisoc, A.L., Min, Y.J.

“…The integrated circuit device is modeled as a four-layer structure with multiple heat sources located on the surface of the first layer and with the fourth…”
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Inflatable space antennas-a brief overview by Cassapakis, C.G., Love, A.W., Palisoc, A.L.

“…The use of inflatable structures in space has both fascinated and challenged many in the space community for forty years or more. The authors present some…”
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Thermal design of integrated circuit devices by Palisoc, A.L., Lee, C.C.

“…An analytical solution derived by the authors (1986) for the thermal analysis of multisource, four-layer ICs has been useful in simulating device thermal…”
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Thermal analysis of solid-state devices using the boundary element method by Lee, C.C., Palisoc, A.L., Baynham, J.M.W.

“…Thermal analysis of two-dimensional and three-dimensional two-layer device structures have been carried out using the boundary element method (BEM). The…”
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Point source thermal response of five-layer anisotropic plate structures by Min, Y.J., Palisoc, A.L., Lee, C.C.

“…The transfer function of a five-layer anisotropic composite structure is derived. Using the inverse Fourier transform, the point source thermal response of the…”
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An integration algorithm for the temperature solution of the four-layer infinite plate structure by Lee, C.C., Min, J., Palisoc, A.L.

“…An algorithm is presented for the effective and accurate integration of the temperature solution of a four-layer plate structure with infinite lateral…”
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Real-time thermal design of integrated circuit devices by Lee, C.C., Palisoc, A.L.

“…A novel method for real-time thermal design of integrated circuits is presented. The method uses a multiple regression technique whose input is the thermal…”
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Transient thermal study of semiconductor devices by Min, Y.J., Palisoc, A.L., Lee, C.C.

“…An analytical three-dimensional transient temperature solution of a two-layer semi-infinite plate structure with embedded heat sources is discussed. The…”
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A general integration algorithm for the inverse Fourier transform of four-layer infinite plate structures by Lee, C.C., Min, Y.J., Palisoc, A.L.

“…An integration algorithm is presented for the effective and accurate integration of the thermal and electrostatic solutions of a four-layer plate structure…”
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Transient thermal study of semiconductor devices by Min, Y.J., Palisoc, A.L., Lee, C.C.

“…An analytical, three-dimensional transient temperature solution of a two-layer semi-infinite plate structure with embedded hear sources is derived. The…”
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