Search Results - "Palara, S."
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Bipolar-MOS monolithic cascode switch in VIPower technology
Published in Proceedings of 1994 IEEE Industry Applications Society Annual Meeting (1994)“…In this paper a bipolar-power MOSFET cascode monolithic device, realized in ST-SGS Thomson VIPower (Vertical Intelligent Power) Technology called M3, is…”
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Conference Proceeding
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2
Modern electronic ignition in VIPower technology
Published in [1993] Proceedings of the 5th International Symposium on Power Semiconductor Devices and ICs (1993)“…A solid-state integrated driver circuit designed to drive a high-energy coil in a microprocessor-based EMS (engine management system) under the direct guidance…”
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Conference Proceeding -
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Three-dimensional transient thermal simulation: application to delayed short circuit protection in power ICs
Published in IEEE journal of solid-state circuits (01-06-1980)“…Thermal effects may represent a limiting factor in the development of integrated circuits. As the power dissipated by integrated circuits becomes more…”
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Journal Article -
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Stationary and Transient Thermal Simulation and Its Use in Power IC Design
Published in Japanese Journal of Applied Physics (01-01-1980)“…Thermal effects may represent a limiting factor in the development of integrated circuits. As the power dissipated by integrated circuits becomes more…”
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Journal Article -
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A new DC model for five-terminals bipolar devices used in smart-power ICs
Published in 1996 IEEE International Symposium on Circuits and Systems (ISCAS) (1996)“…A new DC model for five-terminals bipolar devices used in advanced smart-power applications is presented. The model accounts for all parasitic effects…”
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Conference Proceeding -
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Modern electronic ignition in VIPower technology
Published in Proceedings of the Intelligent Vehicles '94 Symposium (1994)“…The trend for clean, lean-burn engines implies an increased use of microprocessor based engine management system (EMS) with electronic ignition. This paper…”
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Conference Proceeding -
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A New Chip and a New Package for Higher Power
Published in IEEE transactions on consumer electronics (01-02-1980)“…The best of the state of the art in power handling with integrated circuits can be reached only if innova tions are introduced to both the chip and the package…”
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Journal Article -
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Tranisient Thermal Simulation and its Use in Power IC Design
Published in Fifth European Solid State Circuits Conference - ESSCIRC 79 (01-09-1979)Get full text
Conference Proceeding