Search Results - "Paik, WooHyun"
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1
Mobile AP GPU power distribution network simulation and analysis based on chip power model
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01-07-2016)“…These days, mobile devices require low-power consumption. To meet these requirements, IC's operating voltage is continuously lowered. As a result, power noise…”
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2
Rowhammer Vulnerability of DRAMs in 3-D Integration
Published in IEEE transactions on very large scale integration (VLSI) systems (01-05-2024)“…We investigate the vulnerability of 3-D-integrated dynamic random access memorys (DRAMs) [i.e., typically connected with silicon via (TSV), monolithic…”
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3
Outcomes and limitations: EUS-guided hepaticogastrostomy
Published in Endoscopic ultrasound (01-11-2019)“…One of the major roles of interventional EUS is biliary decompression as an alternative to ERCP or percutaneous transhepatic biliary drainage. Among EUS-guided…”
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4
Model-based CMP (Chemical-Mechanical Polishing) proximity correction for mitigating systematic process variations
Published in 2015 International SoC Design Conference (ISOCC) (01-11-2015)“…In this paper we have proposed a way of a model-based CMP proximity correction in sub-28nm SoC (system-on-a-chip) designs. Just like OPC (optical proximity…”
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Conference Proceeding -
5
Simply-Track-and-Refresh: Efficient and Scalable Rowhammer Mitigation
Published in 2023 IEEE International Test Conference (ITC) (07-10-2023)“…Rowhammer is a memory vulnerability that can compromise system-level security. Rowhammer occurs when a DRAM row is accessed repeatedly, potentially causing…”
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6
Dual-polarized patch array antenna package for 5G communication systems
Published in 2017 11th European Conference on Antennas and Propagation (EUCAP) (01-03-2017)“…For applications of 5G (5 th generation mobile networks) communication systems, dual-polarized patch array antenna operating at 28.5 GHz is designed on the…”
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Power distribution network design and optimization based on frequency dependent target impedance
Published in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01-12-2015)“…In this paper, frequency dependent target impedance is proposed for optimal Power Distribution Network (PDN) design. Target impedance indicates how much and…”
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8
Analysis of dynamic voltage drop with PVT variation in FinFET designs
Published in 2014 International SoC Design Conference (ISOCC) (01-11-2014)“…In this paper we have analyzed vectorless dynamic voltage (IR) drops and characterized the impact of transistor-level PVT (process-voltage-temperature)…”
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9
Role of EUS at high risk for choledocholithiasis without severe cholangitis and visible stone on cross-sectional imaging: A multicenter randomized clinical trial
Published in Endoscopic ultrasound (01-11-2021)“…Background and Objectives: The prevalence of choledocholithiasis in the high-risk group of choledocholithiasis has been reported to be slightly more than 50%…”
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10
The underutilization of EUS-guided biliary drainage: Perception of endoscopists in the East and West
Published in Endoscopic ultrasound (01-05-2019)“…Background and Objectives: EUS-guided biliary drainage (EUS-BD) is increasingly utilized to manage unresectable malignant biliary obstruction after a failed…”
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11
Extramedullary plasmacytoma mimicking pancreatic cancer: A case report and literature review
Published in Endoscopic ultrasound (01-07-2017)“…Pancreatic adenocarcinoma may account for more than 80% of all pancreatic neoplasms. Occasionally, other rare tumors such as lymphoma, metastatic tumor, and…”
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12
Improving Analysis Coverage for Dynamic IR Drop Sign-off in FinFET SoC Design
Published in 2020 International SoC Design Conference (ISOCC) (21-10-2020)“…Power grid design is one of the key challenges in large SoC design. In order to guarantee robustness of the power grid, dynamic IR drop should be analyzed…”
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13
Improving of Dynamic IRdrop Performance in FinFET SoC Design
Published in 2019 International SoC Design Conference (ISOCC) (06-10-2019)“…In this paper, we have improved dynamic IRdrop performance in large SoC design through various dynamic IRdrop reduction technique. Robust power/ground rail…”
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14
A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration
Published in 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) (01-03-2018)“…A new Wafer Level System-in-Package (WLSiP) has been designed and developed where Application Processor (AP), Low Power Double Data Rate 4 (LPDDR4) memory, and…”
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