Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages

This paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results...

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Bibliographic Details
Published in:	2007 9th Electronics Packaging Technology Conference pp. 811 - 817
Main Authors:	Kanth, K.R., Paghasian, K.Y., Retuta, D., Toh, C.H., Tanary, S., Tan Hian Boon
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-12-2007
Subjects:	Assembly systems Costs Design optimization Electronics packaging Flip chip Laminates Qualifications Strips System testing Vacuum systems
Online Access:	Get full text
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Summary:	This paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results. The tooling developed is successfully used in the qualification MUF flip chip packages, stacked die FBGA packages and SIP with IR shields. Finally the paper discusses critical mold parameters, their effect on MUF molding and MSL#3 results.
ISBN:	9781424413249 1424413249
DOI:	10.1109/EPTC.2007.4469790