Search Results - "PRIBYTNY, P"
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1
Analysis of reliability and optimization of ESD protection devices supported by modeling and simulation
Published in Microelectronics and reliability (01-06-2012)“…An analysis of electrostatic discharge (ESD) protection structures supported by advanced 2-D mixed mode electro-thermal device and circuit simulation with…”
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Journal Article -
2
Electro-thermal analysis and optimization of edge termination of power diode supported by 2D numerical modeling and simulation
Published in Microelectronics and reliability (01-03-2012)“…High reliability and performance of power semiconductor devices depend on an optimized design based on a good understanding of their electro-thermal behavior…”
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Journal Article Conference Proceeding -
3
Neural Network for Electrothermal Circuit Model of SiC Power MOSFET
Published in 2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM) (11-10-2020)“…This paper presents electrothermal circuit model of SiC power MOSFET. The model is calibrated automatically by artificial neural network (NN). Appropriate…”
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Conference Proceeding -
4
Simulation study of interface traps and bulk traps in n++GaN/InAlN/AlN/GaN high electron mobility transistors
Published in Applied surface science (01-09-2014)“…We investigate the impact of interface traps and bulk traps on the performance of n++GaN/InAlN/AlN/GaN high electron mobility transistors (HEMTs) using…”
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Journal Article -
5
The secret of successful student team project
Published in 2016 11th European Workshop on Microelectronics Education (EWME) (01-05-2016)“…This paper demonstrates authors' practical experience obtained during realization, organization and supervision of the Team Project courses at the Institute of…”
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Conference Proceeding -
6
Electrothermal Model of Power IGBT Module for Circuit Simulations
Published in 2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM) (11-10-2020)“…This paper presents electrothermal circuit model of power IGBT module for circuit simulations. The model interconnects existing models of single IGBT and our…”
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Conference Proceeding -
7
Advanced methodology for fast 3-D TCAD electrothermal simulation of power devices
Published in The Tenth International Conference on Advanced Semiconductor Devices and Microsystems (01-10-2014)“…In this paper the new methodology for fast 3-D electrothermal simulation of complex power devices including the package and cooling assemblies is proposed and…”
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Conference Proceeding -
8
Modeling and characterization of power InAlN/GaN HEMTs supported by 3-D electrothermal simulation
Published in The Tenth International Conference on Advanced Semiconductor Devices and Microsystems (01-10-2014)“…In this paper we present the methodology for a fast 3-D electrothermal simulation based on relaxation method, developed and designed for Synopsys TCAD…”
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Conference Proceeding -
9
TCAD simulation methodology for 3-D electro-physical and optical analysis
Published in The Tenth International Conference on Advanced Semiconductor Devices and Microsystems (01-10-2014)“…Numerical modeling and simulation provide an efficient tool for analysis and optimization of device structure design. In this paper we present a method for the…”
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Conference Proceeding -
10
Power transistor models with temperature dependent parasitic effects for SPICE-like circuit simulation
Published in 2012 28th International Conference on Microelectronics Proceedings (01-05-2012)“…New SPICE-like simulation models for a power MOSFET containing a dynamic link between electrical and thermal component descriptions were described. The…”
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Conference Proceeding -
11
Influence of structure geometry and bulk traps on switching transients of InAlN/GaN HEMT
Published in The Tenth International Conference on Advanced Semiconductor Devices and Microsystems (01-10-2014)“…Impact of structure geometry and bulk traps on the performance of the n ++ GaN/InAlN/AlN/GaN high electron mobility transistor (HEMT) using two-dimensional…”
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Conference Proceeding -
12
2/3-D circuit electro-thermal model of power MOSFET for SPICE-like simulation
Published in The Ninth International Conference on Advanced Semiconductor Devices and Mircosystems (01-11-2012)“…New original SPICE-like simulation model for a power MOSFET based on interactive coupling of electrical and thermal properties is described. The thermal…”
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Conference Proceeding