Search Results - "PIALLAT, Fabien"

Defect-Free Dicing for Higher Device Reliability by Johnston, Christopher, Piallat, Fabien

“…As new technology application devices are relied upon for our safety, security, ease of life and wellbeing, the reliability of such devices is imperative…”
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Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V by PIALLAT, Fabien, BEUGIN, Virginie, GASSILLOUD, Remy, DUSSAULT, Laurent, PELISSIER, Bernard, LEROUX, Charles, CAUBET, Pierre, VALLEE, Christophe

“…Plasma enhanced atomic layer deposition (PEALD) TaCN deposited on HfO2 was studied by X-ray photoelectron spectroscopy (XPS) to understand the reactions taking…”
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Investigation of TiN thin film oxidation depending on the substrate temperature at vacuum break by Piallat, Fabien, Gassilloud, Remy, Caubet, Pierre, Vallée, Christophe

“…Due to the reduction of the thickness of the layers used in the advanced technology nodes, there is a growing importance of the surface phenomena in the…”
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Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias by Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Piallat, Fabien, Burgess, Steve, Price, Andrew, Zhou, Yun, Jones, Christopher, Mathiot, Daniel, Maitrejean, Sylvain

“…•The MOCVD TiN films are N-riched.•Plasma treatment changes the films from amorphous to 7nm crystal grain size.•The films have larger gap in Ti and N…”
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Evaluation of plasma parameters on PEALD deposited TaCN by Piallat, Fabien, Beugin, Virginie, Gassilloud, Remy, Michallon, Philippe, Dussault, Laurent, Pelissier, Bernard, Asikainen, Timo, Maes, Jan Willem, Martin, François, Morin, Pierre, Vallée, Christophe

“…[Display omitted] ► Tuning TaCN deposited material from TaN-like to TaC-like was possible using plasma. ► Influence of plasma power on TaCN properties is…”
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Alternative Deposition Solution for Cost Reduction of TSV Integration by Vitiello, Julien, Piallat, Fabien

“…As one of the key enabler of 3D integration, Through Silicon Via (TSV) was widely investigated but not largely adopted in the advanced packaging industry. TSV…”
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