Search Results - "PAEK, Seungwook"

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    Hybrid Temperature Sensor Network for Area-Efficient On-Chip Thermal Map Sensing by Paek, Seungwook, Shin, Wongyu, Lee, Jaeyoung, Kim, Hyo-Eun, Park, Jun-Seok, Kim, Lee-Sup

    Published in IEEE journal of solid-state circuits (01-02-2015)
    “…Spatial thermal distribution of a chip is an essential information for dynamic thermal management. To get a rich thermal map, the sensor area is required to be…”
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    Journal Article
  3. 3

    PowerField: A Probabilistic Approach for Temperature-to-Power Conversion Based on Markov Random Field Theory by Paek, Seungwook, Shin, Wongyu, Sim, Jaehyeong, Kim, Lee-Sup

    “…Temperature-to-power technique is useful for post-silicon power model validation. However, the previous works were applicable only to the steady-state…”
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    Journal Article
  4. 4

    Homogeneous Stream Processors With Embedded Special Function Units for High-Utilization Programmable Shaders by KIM, Young-Jun, KIM, Hyo-Eun, KIM, Seok-Hoon, PARK, Jun-Seok, PAEK, Seungwook, KIM, Lee-Sup

    “…We embed special function units (SFUs) in homogeneous stream processors (SPs) within a graphics processing unit (GPU), to improve its performance in running…”
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    Journal Article
  5. 5

    An area-efficient on-chip temperature sensor with nonlinearity compensation using injection-locked oscillator (ILO) by Wongyu Shin, Seungwook Paek, Lee-Sup Kim

    “…This paper describes CMOS time-domain temperature sensors. A principle of this type of sensors is CMOS inverter's time-delay variation with temperature. The…”
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    Conference Proceeding
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    Timing error masking by exploiting operand value locality in SIMD architecture by Jaehyeong Sim, Jun-Seok Park, Seungwook Paek, Lee-Sup Kim

    “…A significant amount of energy is consumed by a voltage guardband to ensure error-free operations under the worsening PVT variations in modern processors…”
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    Conference Proceeding
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    All-digital hybrid temperature sensor network for dense thermal monitoring by Seungwook Paek, Wongyu Shin, Jaeyoung Lee, Hyo-Eun Kim, Jun-Seok Park, Lee-Sup Kim

    “…Technology scaling and many-core design trends demand detailed information regarding the spatial temperature distribution, which is essential for dynamic…”
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    Conference Proceeding
  8. 8

    Area-efficient dynamic thermal management unit using MDLL with shared DLL scheme for many-core processors by Seungwook Paek, Jiehwan Oh, Sang-Hye Chung, Lee-Sup Kim

    “…An area-efficient dynamic thermal management (DTM) unit using multiplying delay-locked loop (MDLL) with shared DLL scheme is proposed for per-core DTM in…”
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    Conference Proceeding
  9. 9

    PowerField: a transient temperature-to-power technique based on Markov random field theory by Paek, Seungwook, Moon, Seok-Hwan, Shin, Wongyu, Sim, Jaehyeong, Kim, Lee-Sup

    Published in DAC Design Automation Conference 2012 (03-06-2012)
    “…Transient temperature-to-power conversion is as important as steady-state analysis since power distributions tend to change dynamically. In this work, we…”
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    Conference Proceeding
  10. 10

    A real-time compensated inductive transceiver for wearable MP3 player system on multi-layered planar fashionable circuit board by Seulki Lee, Seungwook Paek, Hoi-Jun Yoo

    “…A wearable MP3 player system on a multi-layered common fabric patch is proposed for an unobtrusive usage in daily life. An inductive coupling transceiver is…”
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    Conference Proceeding
  11. 11

    Live demonstration: A real-time compensated inductive transceiver for wearable MP3 player system on multi-layered planar fashionable circuit board by Seulki Lee, Seungwook Paek, Hoi-Jun Yoo

    “…A wearable MP3 player system on a multi-layered common fabric patch is proposed for an unobtrusive usage in daily life. An inductive coupling transceiver is…”
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    Conference Proceeding
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