Search Results - "Owtscharenko, N."

Advanced through silicon vias for hybrid pixel detector modules by Hügging, F., Owtscharenko, N., Pohl, D.-L., Wermes, N., Ehrmann, O., Fritzsch, T., Mackowiak, P., Oppermann, H., Rothermund, M., Zoschke, K.

“…The through-silicon via (TSV) technology offers high-density vertical stacking of integrated circuits, providing a smaller and simpler structure, whilst…”
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Improving primary-vertex reconstruction with a minimum-cost lifted multicut graph partitioning algorithm by Kostyukhin, V, Keuper, M, Ibragimov, I, Owtscharenko, N, Cristinziani, M

“…JINST 18 (2023) P07013 Particle physics experiments often require the simultaneous reconstruction of many interaction vertices. Usually, this problem is solved…”
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Radiation hard pixel sensors using high-resistive wafers in a 150 nm CMOS processing line by Pohl, D. -L, Hemperek, T, Caicedo, I, Gonella, L, Hügging, F, Janssen, J, Krüger, H, Macchiolo, A, Owtscharenko, N, Vigani, L, Wermes, N

“…Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large…”
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