Search Results - "Ooms, Eric R."

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  1. 1

    Relation between yield and reliability of integrated circuits and application to failure rate assessment and reduction in the one digit FIT and PPM reliability ERA by Van Der Pol, Jacob A., Kuper, Fred G., Ooms, Eric R.

    Published in Microelectronics and reliability (01-11-1996)
    “…Clear relations have been established between E-sort yield and burn-in, EFR and field failure rates for nearly 50 million high volume products in bipolar, CMOS…”
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    Journal Article Conference Proceeding
  2. 2

    Impact of screening of latent defects at electrical test on the yield-reliability relation and application to burn-in elimination by Van der Pol, J.A., Ooms, E.R., Van 't Hof, T., Kuper, F.G.

    “…This paper addresses the question of under what conditions burn-in can be eliminated. Based on data of more than 30 million sold devices, the effect of…”
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    Conference Proceeding
  3. 3

    Occurrence and elimination of anomalous temperature dependence of latchup trigger currents in BiCMOS processes by Ooms, E.R., Van der Pol, J.A.

    “…Latchup trigger currents in a BiCMOS process show an extreme temperature dependence (from >100 mA to <3 mA with /spl Delta/T=1/spl deg/C), severely affecting…”
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    Conference Proceeding
  4. 4

    Short loop monitoring of metal stepcoverage by simple electrical measurements by van der Pol, J.A., Ooms, E.R., Brugman, H.T.

    “…A metal stepcoverage monitoring method using simple electrical measurements has been developed to overcome drawbacks of the standard cross sectioning method…”
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    Conference Proceeding