Delamination Improvement for a QFN Package with Stacked Dies by Finite Element Simulation

Finite Element Method is applied in this study to explore the solution of delamination improvement for a QFN package. Adding hole into clip design is adopted in DOE test as the corrective action. By this study and others in our practices, the criterion with negative peeling stress proves to be effec...

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Bibliographic Details
Published in:	2019 China Semiconductor Technology International Conference (CSTIC) pp. 1 - 3
Main Authors:	Huang, Weidong, Jin, Jian, Yang, April, Wu, Wei, Wu, Jacky, Dong, Grass, Oo, C.F.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-03-2019
Subjects:	Delamination Finite element analysis Lead Simulation Solid modeling Stress Thermal stresses
Online Access:	Get full text
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Summary:	Finite Element Method is applied in this study to explore the solution of delamination improvement for a QFN package. Adding hole into clip design is adopted in DOE test as the corrective action. By this study and others in our practices, the criterion with negative peeling stress proves to be effective for delamination improvement. Further studies and confirmation runs will continue to verify this criterion as general guideline for delamination improvement.
DOI:	10.1109/CSTIC.2019.8755767