Search Results - "Ono, Kouichi"
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Model analysis of the feature profile evolution during Si etching in HBr-containing plasmas
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-2021)“…Feature profiles of Si etched in HBr-containing plasmas have been analyzed through a comparison between experiments and simulations. The emphasis was placed on…”
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Impacts of plasma process-induced damage on MOSFET parameter variability and reliability
Published in Microelectronics and reliability (01-08-2015)“…Plasma process-Induced Damage (PID) is one of the critical issues in designing Metal–Oxide–Semiconductor Field-Effect Transistors (MOSFETs), because PID is…”
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Interactions between Plasmas and Nano-interfaces
Published in Japanese Journal of Applied Physics (20-12-2013)Get full text
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Formation mechanisms of etched feature profiles during Si etching in Cl2/O2 plasmas
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-09-2019)“…Feature profiles of poly-Si etched in Cl2/O2 plasmas have been analyzed through a mechanistic comparison between experiments and simulations. The emphasis was…”
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5
Surface smoothing during plasma etching of Si in Cl2
Published in Applied physics letters (14-11-2016)“…Effects of initial roughness on the evolution of plasma-induced surface roughness have been investigated during Si etching in inductively coupled Cl2 plasmas,…”
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Effects of straggling of incident ions on plasma-induced damage creation in "fin"-type field-effect transistors
Published in Japanese Journal of Applied Physics (01-03-2014)“…We investigated the plasma-induced physical damage (PPD) mechanism in a field-effect transistor (FET) with a fin-type channel, called FinFET. Compared to PPD…”
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7
Modeling of ion-bombardment damage on Si surfaces for in-line analysis
Published in Thin solid films (30-04-2010)“…Structures and mechanism of ion-bombardment damage on silicon wafers exposed to plasma were investigated comprehensively. By using molecular dynamics…”
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Journal Article Conference Proceeding -
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An evaluation method of the profile of plasma-induced defects based on capacitance-voltage measurement
Published in Japanese Journal of Applied Physics (01-06-2017)“…Aggressive shrinkage and geometrical transition to three-dimensional structures in metal-oxide-semiconductor field-effect transistors (MOSFETs) lead to…”
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9
Plasma–surface interactions for advanced plasma etching processes in nanoscale ULSI device fabrication: A numerical and experimental study
Published in Thin solid films (30-04-2010)“…Plasma–surface interactions in Cl- and Br-based plasmas have been studied for advanced front-end-of-line (FEOL) etching processes in nanoscale ULSI device…”
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Journal Article Conference Proceeding -
10
Evaluation technique for plasma-induced SiOC dielectric damage by capacitance-voltage hysteresis monitoring
Published in Japanese Journal of Applied Physics (01-06-2016)“…We propose an electrical method, named capacitance-voltage (C-V) monitoring, for quantifying plasma-induced damage (PID) to interlayer dielectrics. By this…”
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Molecular dynamics simulations of silicon chloride ion incidence during Si etching in Cl-based plasmas
Published in Japanese Journal of Applied Physics (01-05-2014)“…Classical molecular dynamics (MD) simulations have been performed for SiClx+ (x = 0-4) ions incident on Si(100) surfaces, using an improved Stillinger-Weber…”
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12
Influence of microwave annealing on optical and electrical properties of plasma-induced defect structures in Si substrate
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-11-2015)“…The authors investigate the effects of microwave annealing (MWA) on the recovery of plasma process-induced ion-bombardment damage in Si substrates. For damage…”
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13
Modeling and Simulation of Nanoscale Surface Rippling during Plasma Etching of Si under Oblique Ion Incidence
Published in Japanese Journal of Applied Physics (01-08-2012)“…A three-dimensional atomic-scale cellular model (ASCeM-3D) has been developed to reproduce the evolution of feature profiles on atomic or nanometer scale…”
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Structural and electrical characterization of HBr/O2 plasma damage to Si substrate
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-2011)“…Silicon substrate damage caused by HBr/O2 plasma exposure was investigated by spectroscopic ellipsometry (SE), high-resolution Rutherford backscattering…”
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Microplasma thruster for ultra-small satellites: Plasma chemical and aerodynamical aspects
Published in Pure and applied chemistry (01-09-2008)“…A microplasma thruster has been developed of electrothermal type using azimuthally symmetric microwave-excited microplasmas. The microplasma source was ~2 mm…”
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16
Modeling of plasma-induced damage and its impacts on parameter variations in advanced electronic devices
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-2011)“…A comprehensive model predicting the effects of plasma-induced damage (PID) on parameter variations in advanced metal–oxide–semiconductor field-effect…”
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17
An Atomic Scale Model of Multilayer Surface Reactions and the Feature Profile Evolution during Plasma Etching
Published in Japanese Journal of Applied Physics (01-12-2005)“…A phenomenological model has been developed to simulate the feature profile evolution for nanometer-scale control of the profile and critical dimension during…”
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Optical and Electrical Characterization of Hydrogen-Plasma-Damaged Silicon Surface Structures and Its Impact on In-line Monitoring
Published in Japanese Journal of Applied Physics (01-08-2010)“…Si surface damage induced by H 2 plasmas was studied in detail by optical and electrical analyses. Spectroscopic ellipsometry (SE) revealed a decrease in the…”
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Structural, mechanical, and electrical properties of cubic boron nitride thin films deposited by magnetically enhanced plasma ion plating method
Published in Japanese Journal of Applied Physics (01-03-2014)“…We proposed a novel process for improving cubic boron nitride (c-BN) film properties coated on Si substrates, using a magnetically enhanced plasma ion plating…”
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Analytic Model of Threshold Voltage Variation Induced by Plasma Charging Damage in High-$k$ Metal--Oxide--Semiconductor Field-Effect Transistor
Published in Japanese Journal of Applied Physics (01-10-2011)“…We discuss plasma charging damage (PCD) to high-$k$ gate dielectrics and the resultant threshold voltage shift ($\Delta V_{\text{th}}$) in n-channel…”
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