Search Results - "Onai, Takahiro"
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1
Silicon light-emitting transistor for on-chip optical interconnection
Published in Applied physics letters (16-10-2006)“…The authors propose a light-emitting field-effect transistor with the active layer made of the ultrathin single crystal silicon with the (100) surface…”
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2
Improved theory for remote-charge-scattering-limited mobility in metal–oxide–semiconductor transistors
Published in Applied physics letters (23-09-2002)“…Transport theory is extended to include the remote-charge-scattering-limited electron mobility of metal–oxide–semiconductor field-effect transistors. We…”
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3
Electro-Luminescence from Ultra-Thin Silicon
Published in Japanese Journal of Applied Physics (01-07-2006)Get full text
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4
Synthesis, Monolayer Formation, and Control of Electrical Characteristics of 3-nm-Diameter Gold Nanoparticles
Published in Japanese Journal of Applied Physics (01-07-2005)“…A two-dimensional (2D) artificial lattice composed of metal nanoparticles was fabricated and its electrical characteristics were controlled. Each nanoparticle…”
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5
Analytical quantum mechanical model for accumulation capacitance of MOS structures
Published in IEEE electron device letters (01-06-2002)“…We propose a new analytical model to quantitatively simulate capacitance-voltage (C-V) characteristics under accumulation conditions in…”
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6
Effects of remote-surface-roughness scattering on carrier mobility in field-effect-transistors with ultrathin gate dielectrics
Published in Applied physics letters (23-02-2004)“…We examined effects of the remote surface roughness, which is the roughness between the polycrystalline silicon gate and gate dielectric, on the inversion…”
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7
Effect of interfacial oxide on electron mobility in metal insulator semiconductor field effect transistors with Al2O3 gate dielectrics
Published in Microelectronic engineering (01-05-2003)“…We investigated the transistor properties and electron mobility of n-field-effect transistors with Al2O3 gate dielectrics. Post-deposition annealing was…”
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8
Negative bias temperature instability of pMOSFETs with ultra-thin SiON gate dielectrics
Published in 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual (2003)“…The negative bias temperature instability (NBTI) of pMOSFETs with ultra-thin gate dielectrics was investigated from four points of view: basic mechanism of…”
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Conference Proceeding -
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Effect of interfacial oxide on electron mobility in metal insulator semiconductor field effect transistors with Al 2O 3 gate dielectrics
Published in Microelectronic engineering (2003)“…We investigated the transistor properties and electron mobility of n-field-effect transistors with Al 2O 3 gate dielectrics. Post-deposition annealing was…”
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10
Ultra-low-power and high-speed SiGe base bipolar transistors for wireless telecommunication systems
Published in IEEE transactions on electron devices (01-06-1998)“…Ultra-low-power and high-speed SiGe base bipolar transistors that can be used in RF sections of multi-GHz telecommunication systems have been developed. The…”
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11
12-ps ECL using low-base-resistance Si bipolar transistor by self-aligned metal/IDP technology
Published in IEEE transactions on electron devices (01-12-1997)“…A self-aligned metal/IDP (SMI) technology is proposed to reduce the external base resistance and to enable fabrication of high-speed bipolar transistors. This…”
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12
A selective-epitaxial-growth SiGe-base HBT with SMI electrodes featuring 9.3-ps ECL-gate delay
Published in IEEE transactions on electron devices (01-07-1999)“…An ultra-high-speed selective-epitaxial-growth SiGe-base heterojunction bipolar transistor (HBT) with self-aligned stacked metal/in-situ doped poly-Si (IDP)…”
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13
Self-aligned metal/IDP Si bipolar technology with 12-ps ECL and 45-GHz dynamic frequency divider
Published in IEEE transactions on electron devices (01-11-1997)“…Ultra-high-speed operation using a self-aligned stacked metal/in situ doped poly-Si (IDP) (referred to as SMI) Si bipolar transistor technology that offers low…”
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14
A very small bipolar transistor technology with sidewall polycide base electrode for ECL-CMOS LSIs
Published in IEEE transactions on electron devices (01-09-1996)“…Very small, high-performance, silicon bipolar transistors (SPOTEC) are developed for use in ECL-CMOS LSIs. The transistors are fabricated with a sidewall…”
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15
Self-Aligned Metal/IDP Si Bipolar Technology with 12-ps ECL and 45-GHz Dynamic Frequency Divider
Published in ESSDERC '96: Proceedings of the 26th European Solid State Device Research Conference (01-09-1996)“…A self-aligned stacked metal/IDP (SMI) Si bipolar transistor technology that offers low base resistance with shallow impurity profiles is described. This…”
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Conference Proceeding -
16
Ultra-thin-base Si bipolar transistor using rapid vapor-phase direct doping (RVD)
Published in IEEE transactions on electron devices (01-09-1992)“…A novel doping method called rapid vapor-phase direct doping (RVD) is developed to form ultra-shallow junctions. The base region of a conventional bipolar…”
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17
SEPIA: a new isolation structure for soft-error-immune LSIs
Published in IEEE transactions on electron devices (01-02-1993)“…A new isolation structure for soft-error immunity has been developed. This structure, SEPIA (soft-error-preventing isolation by charge absorption), is suitable…”
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18
Self-aligned complementary bipolar technology for low-power dissipation and ultra-high-speed LSIs
Published in IEEE transactions on electron devices (01-03-1995)“…Fully symmetrical complementary bipolar transistors for low power-dissipation and ultra-high-speed LSIs have been integrated in the same chip using a 0.3-/spl…”
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19
A high-current-gain low-temperature pseudo-heterojunction bipolar transistor utilizing sidewall base-contact structure (SICOS)
Published in IEEE transactions on electron devices (01-03-1991)“…An experimental pseudo-heterojunction bipolar transistor (HBT) is described. The pseudo-HBT is a homojunction bipolar transistor having a moderately doped…”
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20
Process design of a novel shielded SBD and its device characteristics
Published in IEEE transactions on electron devices (01-09-1989)“…A shielded Schottky-barrier diode that has the shielding p-layer between the active n-layer and the n/sup +/-buried layer is described. To demonstrate the…”
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