Search Results - "Ohmura, Etsuji"

  • Showing 1 - 10 results of 10
Refine Results
  1. 1

    Influence of thermal expansion coefficient in laser scribing of glass by Yamamoto, Koji, Hasaka, Noboru, Morita, Hideki, Ohmura, Etsuji

    Published in Precision engineering (2010)
    “…Aluminosilicate glass, which has a relatively low thermal expansion coefficient, is used as a glass substrate in liquid crystal displays, whereas soda-lime…”
    Get full text
    Journal Article
  2. 2

    Three-dimensional thermal stress analysis on laser scribing of glass by Yamamoto, Koji, Hasaka, Noboru, Morita, Hideki, Ohmura, Etsuji

    Published in Precision engineering (01-10-2008)
    “…In the laser scribing of glass a thermal stress is introduced into a glass plate by means of CO 2 laser irradiation. The glass plate is rapidly cooled down by…”
    Get full text
    Journal Article
  3. 3

    Influence of glass substrate thickness in laser scribing of glass by Yamamoto, Koji, Hasaka, Noboru, Morita, Hideki, Ohmura, Etsuji

    Published in Precision engineering (2010)
    “…The thickness of the glass substrate used in liquid crystal displays continues to be decreased from its original thickness of 1.1 mm for the purpose reducing…”
    Get full text
    Journal Article
  4. 4

    Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer by Etsuji OHMURA, Masayoshi KUMAGAI, Makoto NAKANO, Koji KUNO, Kenshi FUKUMITSU, Hideki MORITA

    “…In this study, "stealth dicing" (SD) was applied to ultra thin wafers 50 μm in thickness. A coupling problem composed of focused laser propagation in single…”
    Get full text
    Journal Article
  5. 5

    Femtosecond laser fabrication of microspike-arrays on tungsten surface by Sano, Tomokazu, Yanai, Masato, Ohmura, Etsuji, Nomura, Yasumitsu, Miyamoto, Isamu, Hirose, Akio, Kobayashi, Kojiro F.

    Published in Applied surface science (15-07-2005)
    “…Microspike-arrays were fabricated by irradiating a femtosecond laser on a tungsten surface through a mask opening in air. The natural logarithms of the…”
    Get full text
    Journal Article Conference Proceeding
  6. 6

    Thermally stabilized photoinduced Bragg gratings by Nishii, Junji, Kintaka, Kenji, Nishiyama, Hiroaki, Sano, Tomokazu, Ohmura, Etsuji, Miyamoto, Isamu

    Published in Applied physics letters (23-09-2002)
    “…Bragg gratings were printed in Ge–SiO2 and Ge–B–SiO2 thin glass films by KrF excimer laser irradiation through a phase mask. The diffraction efficiency of the…”
    Get full text
    Journal Article
  7. 7

    Femtosecond laser quenching of the ε phase of iron by Sano, Tomokazu, Mori, Hiroaki, Ohmura, Etsuji, Miyamoto, Isamu

    Published in Applied physics letters (27-10-2003)
    “…The quenching of the ε phase of iron, which has not been observed under a conventional shock compression, was attained using a femtosecond laser. The…”
    Get full text
    Journal Article
  8. 8

    Femtosecond laser driven shock synthesis of the high-pressure phase of iron by Sano, Tomokazu, Mori, Hiroaki, Sakata, Osami, Ohmura, Etsuji, Miyamoto, Isamu, Hirose, Akio, Kobayashi, Kojiro F.

    Published in Applied surface science (15-07-2005)
    “…The synthesis of the high-pressure ɛ phase of iron was attained using a femtosecond laser. The crystalline structure in a recovered iron sample was determined…”
    Get full text
    Journal Article Conference Proceeding
  9. 9

    Laser processing of doped silicon wafer by the Stealth Dicing by Kumagai, M., Sakamoto, T., Ohmura, E.

    “…Stealth dicing has outstanding advantages over conventional dicing methods such as blade dicing and laser ablation method. Therefore, stealth dicing is being…”
    Get full text
    Conference Proceeding
  10. 10

    Advanced dicing technology for semiconductor wafer -Stealth Dicing by Kumagai, M., Uchiyama, N., Ohmura, E., Sugiura, R., Atsumi, K., Fukumitsu, K.

    “…"Stealth Dicing (SD) " was developed to solve such inherent problems of dicing process as debris contaminants and unnecessary thermal damage on work wafer. In…”
    Get full text
    Conference Proceeding