Search Results - "Oh, Yongsoo"
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1
Thermal Imprint Lithography onto Filler Incorporated Composite Resin
Published in Japanese Journal of Applied Physics (01-06-2009)Get full text
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2
Numerical and Experimental Evaluation of Picoliter Inkjet Head for Micropatterning of Printed Electronics
Published in Japanese Journal of Applied Physics (01-05-2010)“…A design process based on multiphysics modeling and micro-electro-mechanical systems (MEMS) fabrication has been established to develop a picoliter inkjet…”
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3
A Capacitive Silicon Microaccelerometer with Force-Balancing Electrodes
Published in Japanese Journal of Applied Physics (01-12-1998)“…A surface micromachined accelerometer, which senses an inertial motion with an area variation, has been developed. The accelerometer is designed as an…”
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Journal Article -
4
Two-Input Axis Angular Rate Sensor
Published in Japanese Journal of Applied Physics (01-12-1998)“…A vibrating angular rate sensor is developed by the polysilicon surface micromachining process. The 7.0 µm-thick polysilicon layer is deposited by low-pressure…”
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Journal Article -
5
Development Of Silicon Based Inertial Sensor In SAIT
Published in Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135) (1998)“…Silicon inertial sensors have been developing rapidly during the last decade and are considered as the next mass-produced mechanical sensors after silicon…”
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Conference Proceeding -
6
Microstructure changes in nanoparticulate gold films under different thermal atmospheres and the effects on bondability
Published in Acta materialia (01-10-2009)“…Sintering in a furnace under different thermal atmospheres of air, nitrogen (N 2) or N 2 bubbled through formic acid (FA/N 2) was carried out for a spin-coated…”
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7
The Fabrication of Monolithic Micro Droplet Ejector using MEMS
Published in 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01-01-2006)“…This paper presents the fabrication of a micro droplet ejector for the application of digital printing system. The ejector makes the ink droplets of…”
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Conference Proceeding -
8
The Effects of Driving Waveform of Piezoelectric Industrial Inkjet Head for Fine Patterns
Published in 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01-01-2006)“…This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical…”
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Conference Proceeding -
9
Planar inductor with ferrite layers for DC-DC converter
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)“…The demand for miniaturized magnetic passive devices in power modules has been rapidly growing with mobile handset technology. Thus, we developed a minimum…”
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Conference Proceeding -
10
Microcup Array Fabricated by Thermal Imprint Lithography for E-Paper Application
Published in Molecular Crystals and Liquid Crystals (11-11-2009)“…Thermal imprinting method was developed to provide a microcup array for the application to e-paper, and the imprinted feature was investigated as functions of…”
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11
A Capacitive Silicon Microaccelerometer With Force Balancing Electrodes
Published in Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135) (1998)“…A surface micromachined accelerometer which senses a inertial motion with an area variation is developed. The accelerometer is designed as an interdigital rib…”
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Conference Proceeding -
12
Capacitive type surface-micromachined silicon accelerometer with stiffness tuning capability
Published in Sensors and actuators. A. Physical. (09-03-1999)“…A surface-micromachined silicon accelerometer with a novel concept, which has a stiffness tuning capability to improve the sensor resolution, is developed…”
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Capacitive type surface-micromachined silicon accelerometer with stiffness tuning capability: Special Issue of the Micromechanics Section of Sensors and Actuators, based on contributions revised from the Technical Digest of the Eleventh IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-98), Heidelberg, Germany, 25-29 January 1998
Published in Sensors and actuators. A. Physical. (1999)Get full text
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14
Surface/bulk micromachining (SBM) process and deep trench oxide isolation method for MEMS
Published in International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318) (1999)“…This paper presents a new method for micromachining released structures with single crystal silicon, as well as a new method for electrically isolating the…”
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Conference Proceeding -
15
Two-Input.axis Angular Rate Sensor
Published in Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135) (1998)“…The dual-axis angular rate sensor is fabricated by surface micromachining process. The 7.0 mum thick polysilicon layer deposited by LPCVD is used for…”
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Conference Proceeding -
16
A area variable capacitive microaccelerometer with force-balancing electrodes
Published in IEEE 1998 Position Location and Navigation Symposium (Cat. No.98CH36153) (1998)“…A surface micromachined accelerometer which senses a inertial motion with an area variation is developed. The grid-type planar mass of 7 /spl mu/m thick…”
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Conference Proceeding -
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A surface-micromachined tunable vibratory gyroscope
Published in Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (1997)“…A tunable vibratory microgyroscope was fabricated by surface micromachining technology. The 7.5 /spl mu/m-thick polysilicon structural layer was deposited…”
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Conference Proceeding -
18
Electrostatic actuation of surface/bulk micromachined single-crystal silicon microresonators
“…In fabricating microelectromechanical systems (MEMS), bulk micromachining using [100] and [110] single crystal silicon and surface micromachining using…”
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Conference Proceeding