Search Results - "Ogunsola, O.O."
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Chip-level waveguide-mirror-pillar optical interconnect structure
Published in IEEE photonics technology letters (01-08-2006)“…Waveguides, mirrors, and polymer pillars can be integrated together to provide optical interconnects to the chip level. Total internal reflection in the…”
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Journal Article -
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Optical transmission of polymer pillars for chip I/O optical interconnections
Published in IEEE photonics technology letters (01-01-2004)“…In the pursuit of high-density wafer-level input-output optical interconnections, microscopic polymer pillars have recently been fabricated. The optical…”
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Journal Article -
3
Nutritional Evaluation of a Dehydrated Shredded Meat Product, (Danbunama)
Published in Pakistan journal of nutrition : PJN (15-06-2008)Get full text
Journal Article -
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'trimoda' Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O Interconnects
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…We describe the fabrication, assembly, and testing of a wafer-level package with fully compatible electrical, optical, and fluidic ('trimoda') chip I/O…”
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Conference Proceeding
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Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing
Published in 56th Electronic Components and Technology Conference 2006 (2006)“…We describe low cost compatible electrical and optical flip-chip I/O interconnects to leverage the performance requirements of future high-performance chips…”
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Conference Proceeding -
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Polymer Pillars as Optical I/O for Gigascale Chips using Mirror-Terminated Waveguides
Published in 2006 International Interconnect Technology Conference (2006)“…Polymer pillars are chip-level optical I/Os that provide spatial confinement of light propagating between a chip and a board/substrate. The integration of…”
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Conference Proceeding -
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High-density probe substrate for testing optical interconnects
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (2005)“…The design, fabrication, and demonstration of a high-density probe substrate (100 /spl mu/m pitch) for testing chips with electrical and optical input/output…”
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Conference Proceeding -
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Sea of polymer pillars: dual-mode electrical-optical Input/Output interconnections
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)“…Sea of Polymer Pillars (SoPP) provides highly integrated wafer-level optical and electrical Input/Output (I/O) interconnections for the die-to-module/board…”
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Conference Proceeding