Search Results - "Ochmann, Maximilian"

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  1. 1

    The effect of low temperature conditions on vibration durability of SAC105 interconnects by Meier, Karsten, Ochmann, Maximilian, Leslie, David, Dasgupta, Abhijit, Bock, Karlheinz

    Published in Microelectronics and reliability (01-07-2021)
    “…Electronic assemblies are often utilised in environments in which they are exposed to significant combinations of simultaneous vibration and thermal loads. In…”
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    Journal Article
  2. 2

    Effect of temperature on vibration durability of lead-free solder joints by Höhne, Robert, Meier, Karsten, Dasgupta, Abhijit, Leslie, David, Ochmann, Maximilian, Bock, Karlheinz

    Published in Microelectronics and reliability (01-12-2022)
    “…Safety critical electronics in automotive, avionic or military applications have to work reliably in a range of harsh conditions, including simultaneous…”
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    Journal Article
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    Low Temperature Vibration Reliability of Lead-free Solder Joints by Meier, Karsten, Ochmann, Maximilian, Bock, Karlheinz, Leslie, David, Dasgupta, Abhijit

    “…Work on establishing an experimental setup for isothermal vibration experiments has been recently introduced. The setup enables tests at temperatures from -40…”
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    Conference Proceeding
  6. 6

    The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects by Ochmann, Maximilian, Leslie, David, Meier, Karsten, Dasgupta, Abhijit, Bock, Karlheinz

    “…Electronic assemblies are often utilized in environments in which they are exposed to significant combinations of simultaneous vibration and thermal loads. In…”
    Get full text
    Conference Proceeding