Search Results - "Ochmann, Maximilian"
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The effect of low temperature conditions on vibration durability of SAC105 interconnects
Published in Microelectronics and reliability (01-07-2021)“…Electronic assemblies are often utilised in environments in which they are exposed to significant combinations of simultaneous vibration and thermal loads. In…”
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Journal Article -
2
Effect of temperature on vibration durability of lead-free solder joints
Published in Microelectronics and reliability (01-12-2022)“…Safety critical electronics in automotive, avionic or military applications have to work reliably in a range of harsh conditions, including simultaneous…”
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Journal Article -
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Parallelized Acquisition of Orbitrap and Astral Analyzers Enables High-Throughput Quantitative Analysis
Published in Analytical chemistry (Washington) (24-10-2023)“…The growing trend toward high-throughput proteomics demands rapid liquid chromatography–mass spectrometry (LC–MS) cycles that limit the available time to…”
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Journal Article -
4
A High Dynamic Range Ion Detector for Multireflection Time-of-Flight Analyzers
Published in Journal of the American Society for Mass Spectrometry (02-10-2024)“…Reflectron-based time-of-flight analyzers rely on subnanosecond detector time response to achieve acceptable resolving power for low–mid-mass, multiple-ion…”
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Journal Article -
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Low Temperature Vibration Reliability of Lead-free Solder Joints
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…Work on establishing an experimental setup for isothermal vibration experiments has been recently introduced. The setup enables tests at temperatures from -40…”
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Conference Proceeding -
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The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01-07-2020)“…Electronic assemblies are often utilized in environments in which they are exposed to significant combinations of simultaneous vibration and thermal loads. In…”
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Conference Proceeding