Search Results - "North, Mark T."
-
1
Characterization of evaporation and boiling from sintered powder wicks fed by capillary action
Published in International journal of heat and mass transfer (01-09-2010)“…The thermal resistance to heat transfer into the evaporator section of heat pipes and vapor chambers plays a dominant role in governing their overall…”
Get full text
Journal Article -
2
High frequency, large displacement, and low power consumption piezoelectric translational actuator based on an oval loop shell
Published in Sensors and actuators. A. Physical. (01-04-2012)“…► A compact piezoelectric actuator based on an oval loop shell structure was fabricated and investigated. ► An electrical power input to the piezoelectric…”
Get full text
Journal Article -
3
Enhancing heat transfer in air-cooled heat sinks using piezoelectrically-driven agitators and synthetic jets
Published in International journal of heat and mass transfer (01-01-2014)“…Air-cooled heat sinks are widely used for microelectronics cooling. Piezoelectrically-driven agitators and synthetic jets (syn-jets) have been reported as good…”
Get full text
Journal Article -
4
Piezoelectric translational agitation for enhancing forced-convection channel-flow heat transfer
Published in International journal of heat and mass transfer (01-12-2012)“…Piezoelectric translational agitator (PTA) is proposed and its heat transfer performance is demonstrated by experiments in a narrow channel. For the present…”
Get full text
Journal Article -
5
Modeling and Design Optimization of Ultrathin Vapor Chambers for High Heat Flux Applications
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-09-2012)“…Passive phase-change thermal spreaders, such as vapor chambers have been widely employed to spread the heat from small-scale high-flux heat sources to larger…”
Get full text
Journal Article -
6
Investigation of dry machining with embedded heat pipe cooling by finite element analysis and experiments
Published in International journal of advanced manufacturing technology (01-01-2007)“…This paper investigates the performance of a cutting tool embedded with a heat pipe on reducing cutting temperature and wear in machining. The temperature of a…”
Get full text
Journal Article -
7
Effects of Datacenter Cooling Subsystems Performance on TUE: Air vs. Liquid vs. Hybrid Cooling
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28-05-2024)“…Datacenter cooling systems consist of several subsystems operating in tandem. Each of these subsystems is characterized by a nondimensional Coefficient of…”
Get full text
Conference Proceeding -
8
Three Dimensional Heat Pipe Vapor Chamber Design and Performance
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01-05-2019)“…Air as the cooling medium is the most desirable to many military and OEM commercial companies because it is very reliable, environmentally friendly and…”
Get full text
Conference Proceeding -
9
Thermal performance and flow instabilities in a multi-channel, helium-cooled, porous metal divertor module
Published in Fusion engineering and design (01-11-2000)“…Pressurized helium is under consideration for cooling Langmuir probes and plasma facing components of next generation fusion experiments. Helium is…”
Get full text
Journal Article Conference Proceeding -
10
Reduced Power Precision Temperature Control Using Variable Conductance Heat Pipes
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-12-2013)“…This paper assesses the use of variable conductance heat pipes (VCHPs) for reduced-power precision temperature control of photonics components. When subambient…”
Get full text
Journal Article -
11
Microfabrication of short pin fins on heat sink surfaces to augment heat transfer performance
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01-05-2012)“…Plate-fin heat sinks have been a successful technology in electronics cooling. Thermal performance of such heat sinks, however, has been driven to improve due…”
Get full text
Conference Proceeding