Search Results - "Nogami, T"
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Characterization of "Ultrathin-Cu"/Ru(Ta)/TaN Liner Stack for Copper Interconnects
Published in IEEE electron device letters (01-07-2010)“…Barrier property, gap-fill quality, and electromigration (EM) resistance of a TaN diffusion barrier with ultrathin-Cu/Ru(Ta) liner layers were carried out to…”
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Diabetic state, high plasma insulin and angiotensin II combine to augment endothelin‐1‐induced vasoconstriction via ETA receptors and ERK
Published in British journal of pharmacology (01-12-2008)“…Background and purpose: Mechanisms associated with the enhanced contractile response to endothelin‐1 in hyperinsulinaemic diabetes have been examined using the…”
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Diabetic state, high plasma insulin and angiotensin II combine to augment endothelin‐1‐induced vasoconstriction via ET A receptors and ERK
Published in British journal of pharmacology (29-01-2009)“…Background and purpose: Mechanisms associated with the enhanced contractile response to endothelin‐1 in hyperinsulinaemic diabetes have been examined using the…”
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Mental and physical distress of field veterinarians during and soon after the 2010 foot and mouth disease outbreak in Miyazaki, Japan
Published in Revue scientifique et technique (International Office of Epizootics) (01-12-2015)“…An outbreak of foot and mouth disease occurred in Miyazaki, Japan, in April 2010, and nearly 290,000 animals were culled to control the disease. This study was…”
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The current multidisciplinary approach to fertility preservation for breast cancer patients
Published in Breast (Edinburgh) (01-03-2017)Get full text
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Prospective cohort study of lung oligometastasis of breast cancer
Published in Breast (Edinburgh) (01-03-2017)Get full text
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Composite Interconnects for High-Performance Computing beyond the 7nm Node
Published in 2020 IEEE Symposium on VLSI Technology (01-06-2020)“…We demonstrate a design-technology co-optimization (DTCO) solution for enabling novel composite interconnects in next-generation high-performance computing…”
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Conference Proceeding -
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Laboratory Study of Liquefaction due to Wave–Seabed Interaction
Published in Journal of geotechnical and geoenvironmental engineering (01-07-2006)“…Objects placed on the seabed sink in because of the momentary liquefaction of the seabed due to wave loading. The depth of the momentary liquefaction depends…”
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Effect of re-treatment with gefitinib (‘Iressa’, ZD1839) after acquisition of resistance
Published in Annals of oncology (01-01-2004)Get full text
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Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
Published in 2017 Symposium on VLSI Technology (01-06-2017)“…For beyond 7 nm node BEOL, line resistance (R) is assessed among four metallization schemes: Ru; Co; Cu with TaN/Ru barrier, and Cu with through-cobalt…”
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P282 Significance of tumor-infiltrating lymphocytes in breast cancer with neoadjuvant chemotherapy
Published in Breast (Edinburgh) (01-03-2015)Get full text
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P337 The evaluation of safety of SSM and NSM with reconstruction after NAC for locally advanced BC
Published in Breast (Edinburgh) (01-03-2015)Get full text
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P165 cStage IIIc BC patients diagnosed by PET/CT can get good prognosis with intensive treatment
Published in Breast (Edinburgh) (01-03-2015)Get full text
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P312 Influence of immediate breast reconstruction (IBR) on adjuvant therapy for breast cancer patients
Published in Breast (Edinburgh) (01-03-2015)Get full text
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P289 The evaluation of safety of postmastectomy radiation therapy after immediate breast reconstruction
Published in Breast (Edinburgh) (01-03-2015)Get full text
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67 Correlation Between FDG-PET/CT and Pathological Features in Primary Breast Cancer
Published in European journal of cancer (1990) (01-03-2012)Get full text
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106 Efficacy of One-Step Nucleic Acid Amplification (OSNA) for Intraoperative Diagnosis of Breast Cancer Metastases
Published in European journal of cancer (1990) (01-03-2012)Get full text
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Microstructure and reliability of copper interconnects
Published in IEEE transactions on electron devices (01-06-1999)“…The effects of texture and grain structure on the electromigration lifetime of Cu interconnects are reported. Using different seed layers, [111]- and…”
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Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
Published in Microelectronic engineering (01-04-2012)“…Effects of Cu surface treatment (NH3 plasma irradiation) before the cap dielectric deposition on low-k surface damage and Cu surface cleaning were…”
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