Search Results - "Nogami, T"

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    Characterization of "Ultrathin-Cu"/Ru(Ta)/TaN Liner Stack for Copper Interconnects by Yang, C.-C, Cohen, S, Shaw, T, Wang, P.-C, Nogami, T, Edelstein, D

    Published in IEEE electron device letters (01-07-2010)
    “…Barrier property, gap-fill quality, and electromigration (EM) resistance of a TaN diffusion barrier with ultrathin-Cu/Ru(Ta) liner layers were carried out to…”
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    Journal Article
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    Diabetic state, high plasma insulin and angiotensin II combine to augment endothelin‐1‐induced vasoconstriction via ETA receptors and ERK by Kobayashi, T, Nogami, T, Taguchi, K, Matsumoto, T, Kamata, K

    Published in British journal of pharmacology (01-12-2008)
    “…Background and purpose: Mechanisms associated with the enhanced contractile response to endothelin‐1 in hyperinsulinaemic diabetes have been examined using the…”
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    Journal Article
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    Diabetic state, high plasma insulin and angiotensin II combine to augment endothelin‐1‐induced vasoconstriction via ET A receptors and ERK by Kobayashi, T, Nogami, T, Taguchi, K, Matsumoto, T, Kamata, K

    Published in British journal of pharmacology (29-01-2009)
    “…Background and purpose: Mechanisms associated with the enhanced contractile response to endothelin‐1 in hyperinsulinaemic diabetes have been examined using the…”
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    Journal Article
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    Mental and physical distress of field veterinarians during and soon after the 2010 foot and mouth disease outbreak in Miyazaki, Japan by Makita, K, Tsuji, A, Iki, Y, Kurosawa, A, Kadowaki, H, Tsutsumi, A, Nogami, T, Watari, M

    “…An outbreak of foot and mouth disease occurred in Miyazaki, Japan, in April 2010, and nearly 290,000 animals were culled to control the disease. This study was…”
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    Journal Article
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    Composite Interconnects for High-Performance Computing beyond the 7nm Node by Bhosale, P., Parikh, S., Lanzillo, N., Tao, R., Nogami, T., Gage, M., Shaviv, R., Huang, H., Simon, A., Stolfi, M., Reidy, S., Lee, J., Loubet, N., Haran, B.

    Published in 2020 IEEE Symposium on VLSI Technology (01-06-2020)
    “…We demonstrate a design-technology co-optimization (DTCO) solution for enabling novel composite interconnects in next-generation high-performance computing…”
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    Conference Proceeding
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    Laboratory Study of Liquefaction due to Wave–Seabed Interaction by Chowdhury, B, Dasari, G. R, Nogami, T

    “…Objects placed on the seabed sink in because of the momentary liquefaction of the seabed due to wave loading. The depth of the momentary liquefaction depends…”
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    Journal Article
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    Microstructure and reliability of copper interconnects by Changsup Ryu, Kee-Won Kwon, Loke, A.L.S., Haebum Lee, Nogami, T., Dubin, V.M., Kavari, R.A., Ray, G.W., Wong, S.S.

    Published in IEEE transactions on electron devices (01-06-1999)
    “…The effects of texture and grain structure on the electromigration lifetime of Cu interconnects are reported. Using different seed layers, [111]- and…”
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    Journal Article
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    Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2) by ITO, F, SHOBHA, H, PINTO, T, RYAN, E. T, MADAN, A, HU, C.-K, SPOONER, T, TAGAMI, M, NOGAMI, T, COHEN, S, OSTROVSKI, Y, MOLIS, S, MALONEY, K, FEMIAK, J, PROTZMAN, J

    Published in Microelectronic engineering (01-04-2012)
    “…Effects of Cu surface treatment (NH3 plasma irradiation) before the cap dielectric deposition on low-k surface damage and Cu surface cleaning were…”
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    Conference Proceeding Journal Article
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