Search Results - "Noborio, Masato"

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  1. 1

    Influences of coexisting O2 in H2O-annealing ambient on thermal oxidation kinetics and MOS interface properties on 4H–SiC (1–100) by Chu, Qiao, Noborio, Masato, Shimizu, Sumera, Kita, Koji

    “…On 4H–SiC (1–100) m-face substrate, the process design of SiO2 growth by a conventional thermal oxidation accompanied with post-oxidation annealing (POA) in…”
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    Journal Article
  2. 2

    Influence of Effective Fixed Charges on Short-Channel Effects in SiC Metal--Oxide--Semiconductor Field-Effect Transistors by Noborio, Masato, Suda, Jun, Kimoto, Tsunenobu

    Published in Japanese Journal of Applied Physics (01-02-2010)
    “…Influence of effective fixed charges, which are located near the metal--oxide--semiconductor (MOS) interface, on short-channel effects in 4H-SiC MOS…”
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    Journal Article
  3. 3

    Reliability of Nitrided Gate Oxides for N- and P-Type 4H-SiC(0001) Metal--Oxide--Semiconductor Devices by Noborio, Masato, Grieb, Michael, Bauer, Anton J, Peters, Dethard, Friedrichs, Peter, Suda, Jun, Kimoto, Tsunenobu

    Published in Japanese Journal of Applied Physics (01-09-2011)
    “…In this paper, we have investigated reliability of n- and p-type 4H-SiC(0001) metal--oxide--semiconductor (MOS) devices with N 2 O-grown oxides and deposited…”
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    Journal Article
  4. 4

    P-Channel MOSFETs on 4H-SiC and Nonbasal Faces Fabricated by Oxide Deposition and \hbox\hbox Annealing by Noborio, M., Suda, J., Kimoto, T.

    Published in IEEE transactions on electron devices (01-09-2009)
    “…In this paper, we have investigated 4H-SiC p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with deposited SiO 2 followed by N 2 O…”
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    Journal Article
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    4H-SiC MISFETs with nitrogen-containing insulators by Noborio, Masato, Suda, Jun, Beljakowa, Svetlana, Krieger, Michael, Kimoto, Tsunenobu

    “…4H‐SiC MISFETs with nitrogen‐containing insulators have been fabricated and characterized. Several techniques have been explored to incorporate nitrogen in the…”
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    Journal Article
  8. 8

    4H-SiC MISFETs With 4H-AlN Gate Insulator Isopolytypically Grown on 4H-SiC (11\bar0) by Horita, Masahiro, Noborio, Masato, Kimoto, Tsunenobu, Suda, Jun

    Published in IEEE electron device letters (01-03-2014)
    “…4H silicon carbide (4H-SiC) metal-insulator- semiconductor field-effect transistors (MISFETs) with 4H aluminum nitride (4H-AlN) gate insulators have been…”
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    Journal Article
  9. 9

    Deep-P encapsulated 4H-SiC trench MOSFETs with ultra low RonQgd by Ebihara, Yasuhiro, Ichimura, Aiko, Mitani, Shuhei, Noborio, Masato, Takeuchi, Yuichi, Mizuno, Shoji, Yamamoto, Toshimasa, Tsuruta, Kazuhiro

    “…Deep-P encapsulated 4H-SÌC trench MOSFET was proposed. The fabricated MOSFET with a blocking voltage of 1800V demonstrated a ultra low RonQgd of 133 nCmΩ. The…”
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    Conference Proceeding
  10. 10

    Suppression of Bipolar Degradation in Deep-P Encapsulated 4H-SiC Trench MOSFETs up to Ultra-High Current Density by Ebihara, Yasuhiro, Uehara, Junichi, Ichimura, Aiko, Mitani, Shuhei, Noborio, Masato, Takeuchi, Yuichi, Tsuruta, Kazuhiro

    “…The bipolar degradation of Deep-p encapsulated 4H-SiC trench MOSFETs was investigated by using the pulse-current conduction system up to ultra-high current…”
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    Conference Proceeding
  11. 11

    4H-SiC Lateral Double RESURF MOSFETs With Low on Resistance by Noborio, Masato, Suda, Jun, Kimoto, Tsunenobu

    Published in IEEE transactions on electron devices (01-05-2007)
    “…Designing and fabrication of 4H-SiC (0001) lateral MOSFETs with a double reduced surface field (RESURF) structure have been investigated to reduce ON…”
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    Journal Article
  12. 12

    N 2 O -grown oxides/ 4 H -SiC (0001), ( 03 3 ¯ 8 ) , and ( 11 2 ¯ 0 ) interface properties characterized by using p -type gate-controlled diodes by Noborio, Masato, Suda, Jun, Kimoto, Tsunenobu

    Published in Applied physics letters (13-11-2008)
    “…The N 2 O -grown SiO 2 / 4 H -SiC (0001), ( 03 3 ¯ 8 ) , and ( 11 2 ¯ 0 ) interface properties in p -channel metal-oxide-semiconductor field-effect transistors…”
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    Journal Article
  13. 13

    N 2 O -grown oxides/4H-SiC (0001), (033¯8), and (112¯) interface properties characterized by using p-type gate-controlled diodes by Noborio, Masato, Suda, Jun, Kimoto, Tsunenobu

    Published in Applied physics letters (10-11-2008)
    “…The N2O-grown SiO2/4H-SiC (0001), (033¯8), and (112¯0) interface properties in p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) have been…”
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    Journal Article
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    Experimental and theoretical investigations on short-channel effects in 4H-SiC MOSFETs by Noborio, M., Kanzaki, Y., Jun Suda, Kimoto, T.

    Published in IEEE transactions on electron devices (01-09-2005)
    “…In this paper, a fundamental investigation on short-channel effects (SCEs) in 4H-SiC MOSFETs is given. Planar MOSFETs with various channel lengths have been…”
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    Journal Article
  18. 18

    Enhanced Drain Current of 4H-SiC MOSFETs by Adopting a Three-Dimensional Gate Structure by Nanen, Y., Yoshioka, H., Noborio, M., Suda, J., Kimoto, T.

    Published in IEEE transactions on electron devices (01-11-2009)
    “…4H-SiC (0001) metal-oxide-semiconductor field-effect transistors (MOSFETs) with a 3-D gate structure, which has a top channel on the (0001) face and side-wall…”
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    Journal Article
  19. 19

    4H-SiC MIS Capacitors and MISFETs With Deposited \hbox/ \hbox Stack-Gate Structures by Noborio, M., Suda, J., Kimoto, T.

    Published in IEEE transactions on electron devices (01-08-2008)
    “…SiN x / SiO 2 stack-gate structures, followed by N 2 O annealing, have been investigated to improve the 4H-SiC metal- insulator-semiconductor (MIS) interface…”
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    Journal Article
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    Interface Properties of Metal–Oxide–Semiconductor Structures on 4H-SiC{0001} and (1120) Formed by N 2 O Oxidation by Kimoto, Tsunenobu, Kanzaki, Yosuke, Noborio, Masato, Kawano, Hiroaki, Matsunami, Hiroyuki

    Published in Japanese Journal of Applied Physics (01-03-2005)
    “…4H-SiC(0001), (0001), and (1120) have been directly oxidized by N 2 O at 1300°C, and metal–oxide–semiconductor (MOS) interfaces have been characterized. The…”
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    Journal Article