Search Results - "Nix, W.D."

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  1. 1

    Mechanism-based strain gradient plasticity— I. Theory by Gao, H., Huang, Y., Nix, W.D., Hutchinson, J.W.

    “…A mechanism-based theory of strain gradient plasticity (MSG) is proposed based on a multiscale framework linking the microscale notion of statistically stored…”
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    Journal Article
  2. 2

    Shear band spacing under bending of Zr-based metallic glass plates by Conner, R.D., Li, Yi, Nix, W.D., Johnson, W.L.

    Published in Acta materialia (03-05-2004)
    “…Metallic glasses often exhibit marked ductility when subjected to compressive or bending loads as a result of multiple shear band formation. This observed…”
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    Journal Article
  3. 3

    Mechanism-based strain gradient plasticity—II. Analysis by Huang, Y., Gao, H., Nix, W.D., Hutchinson, J.W.

    “…A mechanism-based theory of strain gradient (MSG) plasticity has been proposed in Part I of this paper. The theory is based on a multiscale framework linking…”
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    Journal Article
  4. 4

    An analytical expression for the stress field around an elastoplastic indentation/contact by Feng, G., Qu, S., Huang, Y., Nix, W.D.

    Published in Acta materialia (01-05-2007)
    “…The stress distribution outside the contact-induced plastic zone can be estimated by the superposition of a Hertzian field and the field for an embedded center…”
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    Journal Article
  5. 5

    Atomistic simulations of elastic deformation and dislocation nucleation during nanoindentation by Lilleodden, E.T., Zimmerman, J.A., Foiles, S.M., Nix, W.D.

    “…Nanoindentation experiments have shown that microstructural inhomogeneities across the surface of gold thin films lead to position-dependent nanoindentation…”
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    Journal Article
  6. 6

    A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction by Budiman, A.S., Han, S.M., Greer, J.R., Tamura, N., Patel, J.R., Nix, W.D.

    Published in Acta materialia (01-02-2008)
    “…When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the “smaller is…”
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    Journal Article
  7. 7

    Soft films on hard substrates — nanoindentation of tungsten films on sapphire substrates by Saha, R, Nix, W.D

    “…We have studied the indentation properties of sputter deposited W thin films on single crystal sapphire substrates in an effort to understand the effects of…”
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    Journal Article Conference Proceeding
  8. 8

    A microbeam bending method for studying stress–strain relations for metal thin films on silicon substrates by Florando, J.N., Nix, W.D.

    “…We have developed a microbeam bending technique for determining elastic–plastic, stress–strain relations for thin metal films on silicon substrates. The method…”
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    Journal Article
  9. 9

    A model for dislocation behavior during deformation of Al/Al3Sc (fcc/L12) metallic multilayers by PHILLIPS, M. A, CLEMENS, B. M, NIX, W. D

    Published in Acta materialia (27-06-2003)
    “…In previously published work, we have reported on the microstructure and indentation hardness of nanoscale Al/Al sub 3Sc multilayers. In this paper, the large…”
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    Journal Article
  10. 10

    Crack-like grain-boundary diffusion wedges in thin metal films by Gao, H., Zhang, L., Nix, W.D., Thompson, C.V., Arzt, E.

    Published in Acta materialia (10-08-1999)
    “…Constrained grain-boundary diffusion in polycrystalline thin metal films on substrates is studied as a strongly coupled elasticity and grain-boundary diffusion…”
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    Journal Article
  11. 11

    A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films by Vlassak, J.J., Nix, W.D.

    Published in Journal of materials research (01-12-1992)
    “…A new analysis of the deflection of square and rectangular membranes of varying aspect ratio under the influence of a uniform pressure is presented. The…”
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    Journal Article
  12. 12

    Stress induced delamination methods for the study of adhesion of Pt thin films to Si by Lee, Alan, Clemens, B.M, Nix, W.D

    Published in Acta materialia (01-04-2004)
    “…Adhesion of Pt films to Si substrates with a native oxide has been investigated using two methods of quantitative adhesion characterization. The…”
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    Journal Article
  13. 13

    Combinatorial studies of mechanical properties of Ti–Al thin films using nanoindentation by Han, Seung Min, Shah, R., Banerjee, R., Viswanathan, G.B., Clemens, B.M., Nix, W.D.

    Published in Acta materialia (01-04-2005)
    “…In this paper, we describe an on-going effort to develop a thin film combinatorial method for identifying alloy compositions of potential interest as…”
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    Journal Article
  14. 14

    A method for interpreting the data from depth-sensing indentation instruments by Doerner, M.F., Nix, W.D.

    Published in Journal of materials research (01-08-1986)
    “…Depth-sensing indentation instruments provide a means for studying the elastic and plastic properties of thin films. A method for obtaining hardness and…”
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    Journal Article
  15. 15

    Anelasticity and damping of thin aluminum films on silicon substrates by Dae-han Choi, Hyungsub Kim, Nix, W.D.

    Published in Journal of microelectromechanical systems (01-04-2004)
    “…A new dynamic measurement system has been developed to investigate damping in thin metal films. This system includes a vacuum chamber, in which a free-standing…”
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    Journal Article
  16. 16

    Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films by Small, Martha K., Nix, W.D.

    Published in Journal of materials research (01-06-1992)
    “…Since its first application to thin films in the 1950's the bulge test has become a standard technique for measuring thin film mechanical properties. While the…”
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    Journal Article
  17. 17

    What is the Young's Modulus of Silicon? by Hopcroft, M.A., Nix, W.D., Kenny, T.W.

    Published in Journal of microelectromechanical systems (01-04-2010)
    “…The Young's modulus ( E ) of a material is a key parameter for mechanical engineering design. Silicon, the most common single material used in…”
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    Journal Article
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    Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history by Flinn, P.A., Gardner, D.S., Nix, W.D.

    Published in IEEE transactions on electron devices (01-03-1987)
    “…Mechanical stress in interconnections is a problem of growing importance in VLSI devices. The origins of this stress are discussed, and a measurement technique…”
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    Journal Article
  20. 20

    Modeling a distribution of point defects as misfitting inclusions in stressed solids by Cai, W., Sills, R.B., Barnett, D.M., Nix, W.D.

    “…The chemical equilibrium distribution of point defects modeled as non-overlapping, spherical inclusions with purely positive dilatational eigenstrain in an…”
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    Journal Article