Search Results - "Niu, Yuling"

CTRP 9 mitigates the apoptosis and unfolded protein response of OGD/R-induced retinal ganglion cells by regulating the AMPK pathway by Yang, Xiaofan, Niu, Yuling

“…C1q/TNF-related protein-9 (CTRP9) has been reported to play roles in several types of retinal diseases. However, the role and the potential mechanism of CTRP9…”
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Crouzon syndrome complicated with binocular strabismus and extraocular muscle fibrosis: a case report by Niu, Yuling, Xu, Jin, Ye, Rushan, Dai, Zixian, Jin, Ling, Geng, Wenwen

“…Crouzon syndrome, a rare genetic disorder characterized by premature closure of coronal sutures, results in skull and facial deformities along with abnormal…”
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A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications by Shao, Shuai, Liu, Dapeng, Niu, Yuling, O'Donnell, Kathy, Sengupta, Dipak, Park, Seungbae

“…Reliability risks for two different types of through-silicon-vias (TSVs) are discussed in this paper. The first is a partially-filled copper TSV, if which the…”
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Preparation of Monodisperse Enrofloxacin Molecularly Imprinted Polymer Microspheres and Their Recognition Characteristics by Zhao, Shanwen, Niu, Yuling, Zhou, Yanqiang, Wang, Xiaoxiao, Gong, Bolin

“…This study presents a new strategy for the detection of enrofloxacin (ENR) in food samples by the use of monodisperse ENR molecularly imprinted polymers…”
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A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization by Yuling Niu, Shuai Shao, Park, S. B., Chin-Li Kao

“…Conventional reflow method in a convection oven is the principal step during the package assembly process in order to guarantee high productivity and make full…”
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Synthesis of Chlorogenic Acid Imprinted Chromatographic Packing by Surface-initiated Atom Transfer Radical Polymerization and Its Application by Niu, Yuling, Ma, Meihua, Gong, Yanru, Wang, Yue, Gong, Bolin

“…A novel chromatographic packing of chlorogenic acid（CGA） molecularly imprinted polymer（MIP） based on the 5.0 ~tm silica was prepared by surface initiated atom…”
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Temperature field simulation on WC-12Co cemented carbide formed by laser powder bed fusion by Niu, Yuling, Li, Xiaofeng, Zhao, Yuxia, Zhang, Li, Liu, Bin, Bai, Peikang

“…A three-dimensional finite element thermal model was established, combined with the finite element software ANSYS, and the simulation of applying a Gaussian…”
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Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical Reliability by Jing Wang, Yuling Niu, Seungbae Park, Yatskov, Alexander

“…The objective of this research is to investigate the design factors that contribute to the thermal deformation and stress development of lidless 2.5D package,…”
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Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling by Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, Seungbae Park, Hohyung Lee, Refai-Ahmed, Gamal, Yip, Laurene

“…2.5D packages have been widely used in electronics industry for high performance and product miniaturization. As Through-Silicon-Via (TSV) fabrication methods…”
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The Expermental and Numerical Study of Electromigration in 2.5D Packaging by Jiefeng Xu, Yuling Niu, Cain, Stephen R., McCann, Scott, Ho Hyung Lee, Refai-Ahmed, Gamal, Park, S. B.

“…In this study, an electromigration (EM) experiment of a ball in a flip chip package with eutectic SnPb solder has been performed. The test vehicles had two…”
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The Complete Packaging Reliability Studies through One Digital Image Correlation System by Yuling Niu, Jing Wang, Park, S. B.

“…Three-dimensional (3-D) digital image correlation (DIC) has been gradually adopted by industry these years. This method utilizes a pair of cameras to…”
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In-Situ Warpage Characterization of BGA Packages with Solder Balls Attached During Reflow with 3D Digital Image Correlation (DIC) by Yuling Niu, Huayan Wang, Shuai Shao, Park, S. B.

“…The decreasing size of solder joints leaves limited tolerance of allowable warpage range for successful assembly. Understanding the electronic packages'…”
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Accessible determination of die-to-wafer bond strength with the Schwickerath test by Shao, Shuai, Niu, Yuling, Wang, Jing, Park, Seungbae, Lee, Bongsub

“…•A test method is proposed to evaluate die-to-wafer bond strength without pre-crack.•This method is validated by simulation, analytical solution and…”
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A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow by Wang, Jing, Niu, Yuling, Shao, Shuai, Wang, Huayan, Xu, Jiefeng, Pham, Vanlai, Park, Seungbae

“…Moisture induced failure is one of the major reliability concerns in electronic packaging. This research provides a comprehensive solution for modeling the…”
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A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method by Niu, Yuling, Wang, Jing, Shao, Shuai, Wang, Huayan, Lee, Hohyung, Park, S.B.

“…The reliability assessment of electronic packages demands more accurate and efficient method for evaluating heterogeneous packages and their interconnects in…”
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A new in-situ warpage measurement of a wafer with speckle -free digital image correlation (DIC) method by Yuling Niu, Hohyung Lee, Seungbae Park

“…During microelectronic manufacturing, a wafer undergoes many fabrication processes. Such processes include exposing a wafer to high temperature. Significant…”
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Die stress in stealth dicing for MEMS by Shuai Shao, Dapeng Liu, Yuling Niu, Seungbae Park

“…Wafer dicing is a necessary and important process in the microelectronics fabrication. Emerging technologies of IC semiconductor have been utilizing…”
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A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method by Niu, Yuling, Wang, Huayan, Park, S.B.

“…Recently, 3-D Digital Image Correlation (DIC) is widely applied to the reliability analysis of electronic packages, which particularly characterizes the…”
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Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method by Van-Lai Pham, Yuling Niu, Jing Wang, Huayang Wang, Singh, Charandeep, Seungbae Park, Cheng Zhong, Sau Wee Koh, Jifan Wang, Shuai Shao

“…The stacked 3D packaging is a trend in current electronic packaging field. The stacked dies are molded to insulate the functional chips from the moisture or…”
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Design guideline on board-level thermomechanical reliability of 2.5D package by Shao, Shuai, Niu, Yuling, Wang, Jing, Liu, Ruiyang, Park, Seungbae, Lee, Hohyung, Yip, Laurene, Refai-Ahmed, Gamal

“…A vast range of electronics products have utilized 2.5D packages for better performance and miniaturization. As multi-level assembly technologies are getting…”
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