A Ka-band low-noise amplifier using semicircle stacked-GCPW transmission line

A Ka-band low-noise amplifier using semicircle stacked-GCPW transmission line

A high‐gain Ka‐band 0.18‐μm CMOS low‐noise amplifier with semicircle stacked grounded coplanar waveguide (SCS‐GCPW) structure transmission line is proposed. SCS‐GCPW transmission line is adopted to reduce the signal loss by shaping the electric fields under the signal line especially at microwave an...

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Bibliographic Details
Published in:Microwave and optical technology letters Vol. 53; no. 5; pp. 1131 - 1134
Main Authors: Chiu, Hsien-Chin, Chen, Ting-Huei, Fu, Jeffrey S., Nirmalathas, T. A.
Format: Journal Article
Language:English
Published: Hoboken Wiley Subscription Services, Inc., A Wiley Company 01-05-2011
Subjects:
0.18-μm CMOS
Amplifiers
Direct current
Electric fields
low-noise amplifiers
Microwaves
Millimeter waves
Noise levels
Reproduction
SCS-GCPW
Transmission lines
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Summary:A high‐gain Ka‐band 0.18‐μm CMOS low‐noise amplifier with semicircle stacked grounded coplanar waveguide (SCS‐GCPW) structure transmission line is proposed. SCS‐GCPW transmission line is adopted to reduce the signal loss by shaping the electric fields under the signal line especially at microwave and millimeter wave applications. The SCS‐GCPW demonstrated a similar electric field distribution of coaxial cable and achieved a substrate dielectric attenuation constant of 0.075 Np/m. It is superior to 0.081 Np/m and 0.144 Np/m of traditional microstrip transmission line and CPW transmission line, respectively. By adopting the low loss SCS‐GCPW transmission line, the Ka‐band LNA demonstrated a 24.5 dB gain together with a noise figure (NF) of 7.5 dB at 33 GHz operation. The measured output power 1 dB compression point (P1 dB) was −2 dBm. The dc power consumption was 40 mW and chip size was 0.6 × 1 mm2 for this Ka‐band LNA. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:1131–1134, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.25910
Bibliography:National Science Council of Taiwan, R.O.C - No. NSC-97-2221-E-182-048-MY3
ArticleID:MOP25910
TSMC through the Chip Implementation Center (CIC) of Taiwan, R.O.C.
istex:D923BDBCE5C48C91D42E279D629253F6DC966CE9
ark:/67375/WNG-N0M42RBW-3
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0895-2477
1098-2760
1098-2760
DOI:10.1002/mop.25910