Stepped notch antenna array used as a low thermal resistance heat sink
A stepped notch antenna at Ku-band is developed to provide a thermal heat sink for active arrays. The antenna with forced air cooling provides up to 0.4 °C/W of thermal resistance. The antenna integration with a printed circuit board allows for high volume surface mount assembly of active devices.
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Published in: | 2013 IEEE Antennas and Propagation Society International Symposium (APSURSI) pp. 622 - 623 |
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Main Authors: | , , , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
01-07-2013
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Subjects: | |
Online Access: | Get full text |
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Summary: | A stepped notch antenna at Ku-band is developed to provide a thermal heat sink for active arrays. The antenna with forced air cooling provides up to 0.4 °C/W of thermal resistance. The antenna integration with a printed circuit board allows for high volume surface mount assembly of active devices. |
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ISSN: | 1522-3965 1947-1491 |
DOI: | 10.1109/APS.2013.6710971 |