Stepped notch antenna array used as a low thermal resistance heat sink

A stepped notch antenna at Ku-band is developed to provide a thermal heat sink for active arrays. The antenna with forced air cooling provides up to 0.4 °C/W of thermal resistance. The antenna integration with a printed circuit board allows for high volume surface mount assembly of active devices.

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Bibliographic Details
Published in:2013 IEEE Antennas and Propagation Society International Symposium (APSURSI) pp. 622 - 623
Main Authors: Duffy, Sean M., Brigham, Glenn A., Newman, Kevin B., Herd, Jeffrey S.
Format: Conference Proceeding
Language:English
Published: IEEE 01-07-2013
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Description
Summary:A stepped notch antenna at Ku-band is developed to provide a thermal heat sink for active arrays. The antenna with forced air cooling provides up to 0.4 °C/W of thermal resistance. The antenna integration with a printed circuit board allows for high volume surface mount assembly of active devices.
ISSN:1522-3965
1947-1491
DOI:10.1109/APS.2013.6710971