JEDEC-Qualified Highly Reliable 22nm FD-SOI Embedded MRAM For Low-Power Industrial-Grade, and Extended Performance Towards Automotive-Grade-1 Applications

We demonstrate highly reliable and mass-production ready 22nm FD-SOI 40Mb embedded-MRAM for industrial-grade (-40~125°C) applications. This technology having 5x solder reflows compatibility stack has passed JEDEC standard qualification (ECC-OFF) with total reliability failures below the product life...

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Bibliographic Details
Published in:2020 IEEE International Electron Devices Meeting (IEDM) pp. 11.3.1 - 11.3.4
Main Authors: Naik, V. B., Yamane, K., Lee, T.Y., Kwon, J., Chao, R., Lim, J.H., Chung, N.L., Behin-Aein, B., Hau, L.Y., Zeng, D., Otani, Y., Chiang, C., Huang, Y., Pu, L., Jang, S.H., Neo, W.P., Dixit, H., Goh, S. K L. C., Toh, E. H., Ling, T., Hwang, J., Ting, J.W., Low, R., Zhang, L., Lee, C.G., Balasankaran, N., Tan, F., Gan, K. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Kriegerstein, V., Merbeth, T., Seet, C.S., Ong, S., Xu, J., Wong, J., You, Y.S., Woo, S.T., Chan, T.H., Quek, E., Siah, S. Y.
Format: Conference Proceeding
Language:English
Published: IEEE 12-12-2020
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Summary:We demonstrate highly reliable and mass-production ready 22nm FD-SOI 40Mb embedded-MRAM for industrial-grade (-40~125°C) applications. This technology having 5x solder reflows compatibility stack has passed JEDEC standard qualification (ECC-OFF) with total reliability failures below the product life-time bit-failure-rate requirement for industrial-grade. Using design-process co-optimization, we show the extended performance to meet -40~150°C product operation for Auto-Grade-1 applications with stable read performance, ~47% reduced read power, data retention of 20yrs (0.1 PPM), read disturb rate of <; 1 PPM for ~1M cycles with 500Oe field, 1M endurance cycles, and stand-by magnetic immunity (SMI) of ~1400Oe at 25°C and ~500Oe at 150°C (0.1 PPM). With magnetic shield-in package solution, we demonstrate ~4kOe SMI at 25°C for 48hrs of field exposure.
ISSN:2156-017X
DOI:10.1109/IEDM13553.2020.9371935