Search Results - "Needes, C."

Advanced thick film system for AlN substrates by Wang, Y.L, Carroll, A.F, Smith, J.D, Cho, Y, Bacher, R.J, Anderson, D.K, Crumpton, J.C, Needes, C.R.S

“…Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used…”
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Copper Materials System for Microcircuitry: A Status Report by R. O. Uhler, R. E. Funer, C. R. Needes, P. C. Donohue, J. D. Mitchell

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Advances in MCM ceramics by AMEY, D. I, HOROWITZ, S. J, NEEDES, C. R. S

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Advanced thick film system for AIN substrates by WANG, Y. L, CARROLL, A. F, SMITH, J. D, CHO, Y, BACHER, R. J, ANDERSON, D. K, CRUMPTON, J. C, NEEDES, C. R. S

“…Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used…”
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Thermosonic Gold Wire Bonding to Copper Conductors by Pitt, V., Needes, C.

“…The use of thick film copper conductors in hybrid microcircuitry requires that wire bonding to their surfaces be demonstrated as a feasible and reliable…”
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Nitrogen-Fireable Resistors: Emerging Technology for Thick-Film Hybrids by Donohue, P., Hormadaly, J., Needes, C., Horowitz, S., Knaak, J.

“…A nitrogen-fireable base-metal thick-film resistor system compatible with copper conductors has been developed. A lanthanum hexaboride conductive phase is used…”
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Constrained-sintered, low-temperature Co-fired ceramic for IC packaging applications by Needes, C.R., Barker, M.F., Ollivier, P.T., Hang, K.W., Souders, K.E., Wang, C.B., Smith, M.A.

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