Search Results - "Nauriyal, Juniyali"
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Enhanced on-chip phase measurement by inverse weak value amplification
Published in Nature communications (29-10-2021)“…Optical interferometry plays an essential role in precision metrology such as in gravitational wave detection, gyroscopes, and environmental sensing. Weak…”
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Journal Article -
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Fiber-to-chip fusion splicing for low-loss photonic packaging
Published in Optica (20-05-2019)Get full text
Journal Article -
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Fiber array to chip attach using laser fusion splicing for low loss
Published in Optics express (19-06-2023)“…With the ever-increasing need for higher data rates, datacom and telecom industries are now migrating to silicon photonics to achieve higher data rates with…”
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Journal Article -
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Fiber to Chip Fusion Splicing for Low Loss Optical Coupling
Published 01-01-2023“…Integrated photonic devices are poised to enter high-volume markets such as data communications, optical phased arrays, and telecommunications; however,…”
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Dissertation -
5
Engineered second-order nonlinearity in silicon nitride
Published in Optical materials express (01-01-2023)“…The lack of a bulk second-order nonlinearity ( χ (2) ) in silicon nitride (Si 3 N 4 ) keeps this low-loss, CMOS-compatible platform from key active functions…”
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Journal Article -
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Low-Loss, High Extinction Ratio Fiber to Chip Connection via Laser Fusion for Polarization Maintaining Fibers
Published in 2023 Optical Fiber Communications Conference and Exhibition (OFC) (01-03-2023)“…We present a new method for PM-fiber to photonic chip connection via laser fusion. This enables low cost and robust coupling with -1.1dB loss per facet while…”
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Conference Proceeding -
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Low-loss, Single-shot Fiber-Array to Chip Attach Using Laser Fusion Splicing
Published in 2022 IEEE Photonics Conference (IPC) (01-11-2022)“…We present a novel technique for attaching up to 8 fiber arrays to a photonic chip in a single shot in less than a minute. We demonstrate a minimum loss of…”
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Conference Proceeding -
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High-speed Electro-optic Modulation in Silicon Nitride
Published in 2023 Conference on Lasers and Electro-Optics (CLEO) (01-05-2023)“…We demonstrate electro-optic modulation up to 15GHz (3dB bandwidth) in a silicon nitride ring resonator by electrically poling the silicon nitride at a high…”
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Conference Proceeding -
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Engineered second-order nonlinearity in silicon nitride
Published 17-10-2022“…The lack of a bulk second-order nonlinearity (\c{hi}(2)) in silicon nitride (Si3N4) keeps this low-loss, CMOS-compatible platform from key active functions…”
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Journal Article -
10
Multiple I/O photonic chip to fiber array packaging using fusion splicing in a single shot
Published in 2020 IEEE Photonics Conference (IPC) (01-09-2020)“…We show a novel multiple I/O photonic packaging method for 4 fiber array using fusion splicing in a single shot. We demonstrate a minimum loss of 2.5dB per…”
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Conference Proceeding -
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Integrated optical gyroscope with inverse weak value amplification
Published in 2022 Conference on Lasers and Electro-Optics (CLEO) (01-05-2022)“…We apply inverse weak value amplification to an integrated Sagnac interferometer gyroscope. We demonstrate rotation measurement with the weak value gyroscope…”
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Conference Proceeding -
12
Low loss and robust photonic packaging using fusion splicing
Published in 2019 Conference on Lasers and Electro-Optics (CLEO) (01-05-2019)“…We show a novel photonic packaging method for permanent optical edge coupling between a fiber and chip using fusion splicing. We demonstrate minimum loss of…”
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Conference Proceeding -
13
Enhanced On-Chip Phase Measurement by Weak Value Amplification
Published in 2020 Conference on Lasers and Electro-Optics (CLEO) (01-05-2020)“…We show, for the first time, phase measurement with weak value amplification on an integrated photonic chip. We demonstrate 9 dB of signal enhancement over a…”
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Conference Proceeding -
14
Single-Shot, Multiple I/O Photonic Chip to Fiber Array Packaging using Fusion Splicing
Published in 2020 Conference on Lasers and Electro-Optics (CLEO) (01-05-2020)“…We show a novel multiple I/O photonic packaging method for 4 fiber array using fusion splicing. We demonstrate a minimum loss of 2.5dB per facet with a…”
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Conference Proceeding -
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Fiber to Chip Fusion Splicing for Robust, Low Loss Optical Coupling
Published in 2018 Conference on Lasers and Electro-Optics (CLEO) (01-05-2018)“…We present a novel method of optical coupling to permanently attach a fiber to a chip using fusion splicing. As proof-of-concept, we achieve 3dB loss per facet…”
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Conference Proceeding -
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Fiber to Chip Fusion Splicing for Robust, Low Loss Photonic Packaging
Published 02-10-2018“…Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased…”
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Journal Article