Search Results - "Nasiatka, P.J."

Determination of optimal solder volume for precision self-alignment of BGA using flip-chip bonding by Nasiatka, P.J., Karim, Z.S.

“…Flip-chip has a pronounced advantage over alternative interconnect technologies such as wire-bonding and TAB due to its ability to exploit area versus…”
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A pixel scale digital to analog converter array for liquid crystal on VLSI displays by Thomsen, A., Lindquist, R.G., Kulick, J.H., Nasiatka, P.J., Nordin, G.P., Kowel, S.T.

“…A pixel scale digital to analog converter and driver for liquid crystal (LC) cells is presented. The circuit is a compact CMOS logic gate that sums pulse…”
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