Search Results - "Nakamoto, Mark"
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Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs
Published in IEEE transactions on very large scale integration (VLSI) systems (01-01-2012)“…Reducing interconnect delay and power consumption has become a major concern in deep submicron designs. 3-D technologies have been proposed as a promising…”
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Journal Article -
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Simulation methodology and flow integration for 3D IC stress management
Published in IEEE Custom Integrated Circuits Conference 2010 (01-09-2010)“…A new methodology to bridge package and silicon domain simulations is demonstrated using a new data file to facilitate stress information exchange. The flow…”
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Conference Proceeding
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3
Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01-06-2020)“…With the increasing requirement for advanced technology nodes in high-performance devices, low-K (LK), ultralow-K (ULK) and extreme low K (ELK) dielectric…”
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Conference Proceeding -
4
System Design Technology Co-Optimization for 3D Integration at <5nm nodes
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11-12-2021)“…Partition of monolithic 2D (M2D) chip and heterogeneous integration of resultant chiplets are inevitable in the near future due to rising cost of transistor…”
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Conference Proceeding -
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Mechanical stress management for electrical chip-package interaction (e-CPI)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01-05-2014)“…e-CPI has emerged as a new risk in modern chip design as silicon dies become increasingly thinner and packages become increasingly more complex. e-CPI is…”
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Conference Proceeding -
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A complete and automatic advanced model verification platform for 32nm technology and beyond
Published in 2009 IEEE International Reliability Physics Symposium (01-04-2009)“…Variability from different sources such as layout-dependent effect has been a main obstacle against aggressive design rule and shrinking corner margins in 45…”
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Conference Proceeding -
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Design for manufacturability for fabless manufactuers
Published in IEEE solid state circuits magazine (01-01-2009)“…When a company designs and sells ICs but outsources their manufacture, design for manufacturability poses special challenges. It is clear that these DfM…”
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Journal Article -
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Diabetes quiz. How much do you know about heart disease risk?
Published in Diabetes self-management (01-09-2005)Get more information
Magazine Article -
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H-B-A-1-C (what it is and why it matters)
Published in Diabetes self-management (01-01-2004)Get more information
Magazine Article -
10
Diabetes medicine update. Old dogs, new tricks
Published in Diabetes self-management (01-01-2003)Get more information
Magazine Article -
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Clinical trials? Should you sign up?
Published in Diabetes self-management (01-09-2002)Get more information
Magazine Article -
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A complete stress enhancement model development and verification platform for 32nm technology and beyond
Published in 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (01-11-2010)“…Variability from different sources such as layout-dependent effects due to strain has been a main obstacle against aggressive design rules and reducing corner…”
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Conference Proceeding -
13
New tools 2004
Published in Diabetes self-management (01-11-2004)Get more information
Magazine Article -
14
FT.com site : Korea threatens to 'bolster war deterrent'
Published in ft.com (17-07-2006)Get full text
Newspaper Article -
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FT.com site : N Korea threatens to 'bolster war deterrent'
Published in ft.com (16-07-2006)Get full text
Newspaper Article -
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FT.com site : Why VoIP telephony is quickly coming of age
Published in ft.com (08-09-2005)Get full text
Newspaper Article -
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FT.com site : Vodafone pursues virtual operators
Published in ft.com (16-11-2005)Get full text
Newspaper Article -
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FT.com site : UN resolution against N Korea runs aground
Published in ft.com (10-07-2006)Get full text
Newspaper Article