Search Results - "Nagler, Oliver"

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    Mechanical Robustness Analysis of Semiconductors with a Single Needle Probe Card Using Acoustic Emissions by Tremmel, Florian, Nagler, Oliver, Kutter, Christoph, Holmer, Rainer

    Published in E-journal of Nondestructive Testing (01-10-2024)
    “…The combination of indentation testing and acoustic emission (AE) is widely used to analyze the fracture toughness of test substrates. In the manufacturing of…”
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    Journal Article
  3. 3

    Organic Light‐Emitting Diodes Based on Silandiol‐Bay‐Bridged Perylene Bisimides by Brust, Felix, Nagler, Oliver, Shoyama, Kazutaka, Stolte, Matthias, Würthner, Frank

    Published in Advanced optical materials (01-03-2023)
    “…Perylene bisimides (PBIs) are among the best fluorophores but have to be enwrapped for optoelectronic applications by large and heavy substituents to prevent…”
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    Journal Article
  4. 4

    Yellow Light-Emitting Highly Soluble Perylene Bisimide Dyes by Acetalization of Bay-Hydroxy Groups by Nagler, Oliver, Krause, Ana-Maria, Shoyama, Kazutaka, Stolte, Matthias, Dubey, Rajeev K., Liu, Linlin, Xie, Zengqi, Würthner, Frank

    Published in Organic letters (23-09-2022)
    “…A new class of perylene bisimide (PBI) derivatives is introduced by bridging 1,12- and 1,6,7,12-hydroxy functionalized bay positions with oxygen–carbon–oxygen…”
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    Journal Article
  5. 5

    Cluster-based acoustic emission signal processing and loading rate effects study of nanoindentation on thin film stack structures by Liu, Chen, Nagler, Oliver, Tremmel, Florian, Unterreitmeier, Marianne, Frick, Jessica J., Patil, Radhika P., Gu, X. Wendy, Senesky, Debbie G.

    Published in Mechanical systems and signal processing (15-02-2022)
    “…•Prediction of degradation of multilayer thin film stack structures on Si wafer via acoustic emission (AE) testing integrated with a nanoindentation…”
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    Journal Article
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    Nanoindentation characterization of thin film stack structures by finite element analysis and experiments using acoustic emission testing by Liu, Chen, Nagler, Oliver, Tremmel, Florian, Unterreitmeier, Marianne, Frick, Jessica J., Gu, X. Wendy, Senesky, Debbie G.

    “…Increased risk of crack formation in the brittle insulating layers of crack-sensitive backend-of-line (BEOL) structures in semiconductor integrated circuits…”
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    Journal Article
  7. 7

    An Improved Model of Electrical Contact Resistance of Pad-Probe Interaction during Wafer Test by Nagler, Oliver, Krebs, Tobias, Heuken, Michael

    “…Semiconductor wafer test requires a stable electrical contact resistance between each individual I/O pad and the probe needle. Due to the strong sensitivity of…”
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    Conference Proceeding
  8. 8

    Tetrahydroxy‐Perylene Bisimide Embedded in a Zinc Oxide Thin Film as an Electron‐Transporting Layer for High‐Performance Non‐Fullerene Organic Solar Cells by Wen, Xinbo, Nowak‐Król, Agnieszka, Nagler, Oliver, Kraus, Felix, Zhu, Na, Zheng, Nan, Müller, Matthias, Schmidt, David, Xie, Zengqi, Würthner, Frank

    Published in Angewandte Chemie (09-09-2019)
    “…By introduction of four hydroxy (HO) groups into the two perylene bisimide (PBI) bay areas, new HO‐PBI ligands were obtained which upon deprotonation can…”
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    Journal Article
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    Efficient design and optimization of MEMS by integrating commercial simulation tools by Nagler, Oliver, Trost, Michael, Hillerich, Bernd, Kozlowski, Frank

    Published in Sensors and actuators. A, Physical (01-04-1998)
    “…This article presents a simulation tool for developing and characterizing microelectromechanical systems (MEMS). Because of the heterogeneous structure of…”
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    Journal Article Conference Proceeding
  10. 10

    Application of finite element method and SPICE simulation for design optimization of oven-controlled crystal oscillators by Hillerich, B., Nagler, O.

    “…Thermal finite element method (FEM) calculations and SPICE-based dynamic thermal models are used to simulate and optimize the static and dynamic performance of…”
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    Journal Article