Search Results - "Mouthaan, A.J.T."

Fast thermal cycling-enhanced electromigration in power metallization by Nguyen, H.V., Salm, C., Krabbenborg, B.H., Bisschop, J., Mouthaan, A.J.T., Kuper, F.G.

“…Multilevel interconnects used in power ICs are susceptible to short circuit failure due to a combination of fast thermal cycling and electromigration stresses…”
Get full text

Significance of including substrate capacitance in the full chip circuit model of ICs under CDM stress by Sowariraj, M.S.B., de Jong, P.C., Cora, S.M., Smedes, T., Mouthaan, A.J.T., Kuper, F.G.

“…In the CDM type of ESD, the IC is both the source and part of the discharge current path. To study the CDM performance of an IC, a full-chip circuit model that…”
Get full text