Search Results - "Mouis, M."

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  1. 1

    Revisited parameter extraction methodology for electrical characterization of junctionless transistors by Jeon, D.-Y., Park, S.J., Mouis, M., Berthomé, M., Barraud, S., Kim, G.-T., Ghibaudo, G.

    Published in Solid-state electronics (01-12-2013)
    “…► Conventional parameter extraction methodologies were revisited for the electrical characterization of JLT devices. ► Interestingly, two slopes in the…”
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    Journal Article Conference Proceeding
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    Three-Dimensional Real-Space Simulation of Surface Roughness in Silicon Nanowire FETs by Buran, C., Pala, M.G., Bescond, M., Dubois, M., Mouis, M.

    Published in IEEE transactions on electron devices (01-10-2009)
    “…We address the transport properties of narrow gate-all-around silicon nanowires in the presence of surface-roughness (SR) scattering at the Si/SiO 2 interface,…”
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    Journal Article
  4. 4

    Calculations of hole mass in [1 1 0]-uniaxially strained silicon for the stress-engineering of p-MOS transistors by Guillaume, T., Mouis, M.

    Published in Solid-state electronics (01-04-2006)
    “…The influence of stress on transport properties in p-MOSFETs is rather well known for the case of biaxially strained channels obtained using hetero-epitaxy…”
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    Journal Article Conference Proceeding
  5. 5

    DC and low frequency noise characterization of FinFET devices by Bennamane, K., Boutchacha, T., Ghibaudo, G., Mouis, M., Collaert, N.

    Published in Solid-state electronics (01-12-2009)
    “…A detailed DC and LF noise characterization of FinFETs is carried out. Parameter extraction conducted at room and low temperature clearly indicates that the…”
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    Journal Article
  6. 6

    An accelerated algorithm for 2D simulations of the quantum ballistic transport in nanoscale MOSFETs by Ben Abdallah, N., Mouis, M., Negulescu, C.

    Published in Journal of computational physics (01-07-2007)
    “…An accelerated algorithm for the resolution of the coupled Schrödinger/Poisson system, with open boundary conditions, is presented. This method improves the…”
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    Journal Article
  7. 7

    Experimental evaluation of gate architecture influence on DG SOI MOSFETs performance by Widiez, J., Lolivier, J., Vinet, M., Poiroux, T., Previtali, B., Dauge, F., Mouis, M., Deleonibus, S.

    Published in IEEE transactions on electron devices (01-08-2005)
    “…Using a novel process flow, we managed to cointegrate several devices on the same wafer; single gate (SG), ground plane (GP), perfectly aligned double gate…”
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    Journal Article
  8. 8

    A new method for the extraction of flat-band voltage and doping concentration in Tri-gate Junctionless Transistors by Jeon, D.-Y., Park, S.J., Mouis, M., Barraud, S., Kim, G.-T., Ghibaudo, G.

    Published in Solid-state electronics (01-03-2013)
    “…► We report a new parameter extraction method for Junctionless Transistors (JLTs). ► Flat-band voltage (Vfb) of Tri-gate JLT devices was extracted by the new…”
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    Journal Article
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    Experimental characterization of the subthreshold leakage current in triple-gate FinFETs by Tsormpatzoglou, A., Dimitriadis, C.A., Mouis, M., Ghibaudo, G., Collaert, N.

    Published in Solid-state electronics (01-03-2009)
    “…The gate and subthreshold drain leakage currents are investigated experimentally in triple-gate FinFETs for power supply voltage V dd = 1 V. The gate and drain…”
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    Journal Article
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    Study of annealing temperature influence on the performance of top gated graphene/SiC transistors by Clavel, M., Poiroux, T., Mouis, M., Becerra, L., Thomassin, J.L., Zenasni, A., Lapertot, G., Rouchon, D., Lafond, D., Faynot, O.

    Published in Solid-state electronics (01-05-2012)
    “…► We used a 20nm ALD alumina layer as high-k gate dielectric on graphene. ► Annealed alumina dielectric prevents graphene from adsorbing impurities. ► This…”
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    Journal Article Conference Proceeding
  12. 12

    Modeling of remote Coulomb scattering limited mobility in MOSFET with HfO2/SiO2 gate stacks by BARRAUD, S, THEVENOD, L, CASSE, M, BONNO, O, MOUIS, M

    Published in Microelectronic engineering (01-09-2007)
    “…The reduction of electron mobility in MOSFET with HfO2/SiO2 gate stack is analyzed using a model for remote Coulomb scattering (RCS) due to charges fixed at…”
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    Conference Proceeding Journal Article
  13. 13

    Differential magnetoresistance technique for mobility extraction in ultra-short channel FDSOI transistors by Chaisantikulwat, W., Mouis, M., Ghibaudo, G., Gallon, C., Fenouillet-Beranger, C., Maude, D.K., Skotnicki, T., Cristoloveanu, S.

    Published in Solid-state electronics (01-04-2006)
    “…Ultra-thin Silicon-on-Insulator (SOI) transistor has proved to offer advantages over bulk MOSFETs for high-speed, low power applications. However, there is…”
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    Journal Article Conference Proceeding
  14. 14

    Experimental evidence of mobility enhancement in short-channel ultra-thin body double-gate MOSFETs by magnetoresistance technique by Chaisantikulwat, W., Mouis, M., Ghibaudo, G., Cristoloveanu, S., Widiez, J., Vinet, M., Deleonibus, S.

    Published in Solid-state electronics (01-11-2007)
    “…Double-gate transistor with ultra-thin body (UTB) has proved to offer advantages over bulk device for high-speed, low-power applications. There is thus a…”
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    Journal Article Conference Proceeding
  15. 15

    Experimental evidence and extraction of the electron mass variation in [1 1 0] uniaxially strained MOSFETs by Rochette, F., Cassé, M., Mouis, M., Reimbold, G., Blachier, D., Leroux, C., Guillaumot, B., Boulanger, F.

    Published in Solid-state electronics (01-11-2007)
    “…In this paper, we investigate electron mobility enhancement in [1 1 0] uniaxially strained nMOSFETs with three different channel orientations on a [0 0 1] Si…”
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    Journal Article Conference Proceeding
  16. 16

    Strain sensitivity of gate leakage in strained-SOI nMOSFETs: A benefit for the performance trade-off and a novel way to extract the strain-induced band offset by Rochette, F., Garros, X., Reimbold, G., Andrieu, F., Cassé, M., Mouis, M., Ghibaudo, G., Boulanger, F.

    Published in Microelectronic engineering (01-07-2009)
    “…The impact of biaxial stress on gate leakage is investigated on fully-depleted silicon-on-insulator (FD-SOI) nMOS transistors, integrating either a standard…”
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    Journal Article Conference Proceeding
  17. 17

    Mechanical simulation of stress engineering solutions in highly strained p-type FDSOI MOSFETs for 14-nm node and beyond by Oudrhiri, A. Idrissi-El, Martinie, S., Barbe, J.-C, Rozeau, O., Le Royer, C., Jaud, M.-A, Lacord, J., Bernier, N., Grenouillet, L., Rivallin, P., Pelloux-Prayer, J., Casse, M., Mouis, M.

    “…Stress engineering is a powerful tool to enhance nanoscale device performances. In this study we developed a methodology of 14nm strained pMOS FDSOI device…”
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    Conference Proceeding Journal Article
  18. 18

    Full-three dimensional quantum approach to evaluate the surface-roughness-limited magnetoresistance mobility in SNWT by Buran, C., Pala, M. G., Bescond, M., Mouis, M.

    Published in Journal of computational electronics (01-09-2008)
    “…We present a theoretical method to simulate magnetotransport in silicon nanowire (Si-NW) MOSFET including the effect of Surface Roughness (SR). We use a full…”
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    Journal Article Conference Proceeding
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    Influence of TiN metal gate on Si/SiO2 surface roughness in N and PMOSFETs by Thevenod, L., Cassé, M., Mouis, M., Reimbold, G., Fillot, F., Guillaumot, B., Boulanger, F.

    Published in Microelectronic engineering (01-06-2005)
    “…In this article, we report the influence of TiN gate on electron and hole channel mobility at low temperatures down to 13K. TiN gate is found to modify the…”
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    Journal Article Conference Proceeding
  20. 20

    Ultrathin Nanogenerators as Self-Powered/Active Skin Sensors for Tracking Eye Ball Motion by Lee, Sangmin, Hinchet, Ronan, Lee, Yean, Yang, Ya, Lin, Zong-Hong, Ardila, Gustavo, Montès, Laurent, Mouis, Mireille, Wang, Zhong Lin

    Published in Advanced functional materials (01-02-2014)
    “…Ultrathin piezoelectric nanogenerator (NG) with a total thickness of ≈16 μm is fabricated as an active or self‐powered sensor for monitoring local deformation…”
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    Journal Article