Search Results - "Mouawad, Bassem"

Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding by Mouawad, B., Soueidan, M., Fabregue, D., Buttay, C., Allard, B., Bley, V., Morel, H., Martin, C.

“…Planar structures, in which a power die is soldered on a substrate and wirebonds are used to connect the top of the die with the substrate, are limited in…”
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10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field by DiMarino, Christina M., Mouawad, Bassem, Johnson, C. Mark, Boroyevich, Dushan, Burgos, Rolando

“…The advancement of silicon carbide (SiC) power devices with voltage ratings exceeding 10 kV is expected to revolutionize medium- and high-voltage systems…”
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Multi-Chip SiC MOSFET Power Modules for Standard Manufacturing, Mounting and Cooling by Castellazzi, Alberto, Fayyaz, Asad, Gurpinar, Emre, Hussein, Abdallah, Jianfeng Li, Mouawad, Bassem

“…Taking full advantage of the superior characteristics of SiC Power MOSFETs in the application requires the development of bespoke packaging solutions. Their…”
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Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling by Agyakwa, Pearl A., Robertson, Stuart, Dai, Jingru, Mouawad, Bassem, Zhou, Zhaoxia, Liu, Changqing, Johnson, C. Mark

“…This paper deals with the performance of sintered nano-silver bonds used as wide-bandgap power module die attachment technology. The paper specifically…”
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Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling by Hussein, Abdallah, Mouawad, Bassem, Castellazzi, Alberto

“…Recently, 3.3 and 6.5 kV power MOSFETs have been introduced. Based on the 3.3 kV device, a 100 A half-bridge power module has been developed, using parallel…”
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Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module by DiMarino, Christina, Mouawad, Bassem, Johnson, C. Mark, Wang, Meiyu, Tan, Yan-Song, Lu, Guo-Quan, Boroyevich, Dushan, Burgos, Rolando

“…Wide bandgap (WBG) power devices with voltage ratings exceeding 10 kV have the potential to revolutionize medium- and high-voltage systems due to their…”
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Tailoring the microstructure and the mechanical properties of ultrafine grained high strength ferritic steels by powder metallurgy by Mouawad, B, Boulnat, X, Fabregue, D, Perez, M, de Carlan, Y

“…Three model powder materials (i) atomized, (ii) atomized + milled, and, (iii) atomized + milled + alloyed with yttria (Y sub(2)O sub(3)) and titanium were…”
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Development of a highly integrated 10 kV SiC MOSFET power module with a direct jet impingement cooling system by Mouawad, Bassem, Skuriat, Robert, Li, Jianfeng, Johnson, C. Mark, DiMarino, Christina

“…High-density packaging of fast-switching power semiconductors typically requires low thermal resistance and low parasitic inductance. High-density packaging of…”
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Heterogeneous Integration of Magnetic Component Windings on Ceramic Substrates by Stratta, Andrea, Mouawad, Bassem, Antonini, Mattia, De Lillo, Liliana, Empringham, Lee, Johnson, Mark C.

“…Heterogeneous integration and the converter in package concept have been highlighted as enabling technologies to unlock the full potential of silicon carbide…”
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Packaging degradation studies of High Temperature SiC MOSFET discrete packages by Mouawad, Bassem, Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, C. Mark

“…Silicon Carbide discrete packages with high temperature capabilities have been used to study the package degradation. Power Cycling test and thermal cycling…”
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A thermal cycling reliability study of ultrasonically bonded copper wires by Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.

“…In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results…”
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Hybrid half-bridge package for high voltage application by Mouawad, Bassem, Jianfeng Li, Castellazzi, Alberto, Johnson, C. Mark

“…3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a…”
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Full Densification of Molybdenum Powders Using Spark Plasma Sintering by Mouawad, B., Soueidan, M., Fabrègue, D., Buttay, C., Bley, V., Allard, B., Morel, H.

“…Pure molybdenum powder was sintered using spark plasma sintering (SPS) under various temperatures and holding times, under a pressure of 77 MPa and a heating…”
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Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test by Mouawad, Bassem, Thollin, Benoit, Buttay, Cyril, Dupont, Laurent, Bley, Vincent, Fabregue, Damien, Soueidan, Maher, Schlegel, Benoit, Pezard, Julien, Crebier, Jean-Christophe

“…3-D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a…”
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Packaging for fast switching power electronics by Marchant, Stewart, Dai, Jingru, Mouawad, Bassem, Empringham, Lee, Clare, Jon

“…This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding…”
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Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications by Mouawad, Bassem, Buttay, C., Soueidan, M., Morel, H., Bley, V., Fabregue, D., Mercier, F.

“…Silicon Carbide (SiC) is a good candidate for high temperature power electronic applications. To ensure good reliability, packaging materials with a…”
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Novel Silicon Carbide Integrated Power Module for EV application by Mouawad, Bassem, Espina, Jordi, Li, Jianfeng, Empringham, Lee, Johnson, C. Mark

“…The successful penetration of Electric Vehicles (EVs) into the global automotive markets requires the developments of cost effective, high performance and high…”
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A novel manufacturing technique for integrating magnetic components windings on power module substrates by Stratta, Andrea, Mouawad, Bassem, Ahmadi, Behzad, de Lillo, Liliana, Empringham, Lee, Johnson, Mark

“…In this paper a novel manufacturing technique is investigated with the aim of integrating magnetic components (e.g. inductors and transformer) on power module…”
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3.3 kV SiC JBS diode configurable rectifier module by Mouawad, Bassem, Zhenyu Wang, Buettner, Jonas, Castellazzi, Alberto

“…This paper presents the use of innovative high-voltage SiC diode technology in the development of a user configurable full-wave or half-wave rectifier bridge…”
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Design of a novel, high-density, high-speed 10 kV SiC MOSFET module by DiMarino, Christina, Johnson, Mark, Mouawad, Bassem, Jianfeng Li, Boroyevich, Dushan, Burgos, Rolando, Guo-Quan Lu, Meiyu Wang

“…High-density packaging of fast-switching power semiconductors typically requires low thermal resistance and parasitic inductance. High-density packaging of…”
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