Search Results - "Mosely, R."
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1
Which women choose a copper IUD for emergency contraception when offered the same day?
Published in Contraception (Stoneham) (01-10-2015)Get full text
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2
Randomized controlled phase II trial of glatiramer acetate in ALS
Published in Neurology (11-04-2006)“…The authors conducted a randomized controlled trial to test the safety and immunology of glatiramer acetate in ALS. Twenty treated patients were randomly…”
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3
Chemical vapor deposited TiCN: A new barrier metallization for submicron via and contact applications
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-05-1995)“…High quality chemical vapor deposited (CVD) TiCN films were produced in a single wafer reactor using a metalorganic precursor (tetrakisdimethylamino titanium)…”
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4
Resistivity reduction and chemical stabilization of organometallic chemical vapor deposited titanium nitride by nitrogen rf plasma
Published in Applied physics letters (12-02-1996)“…In situ, nitrogen rf plasma treatment of organometallic chemical vapor deposited (OMCVD) TiN, synthesized by thermal decomposition of tetrakis(dimethylamido)…”
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5
Nucleation and growth of CVD Al on different types of TiN
Published in Thin solid films (04-05-1998)“…The deposition of Al by CVD on top of a Ti/TiN liner is a very promising approach for filling gaps with a high aspect ratio. In this work we have studied the…”
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Journal Article Conference Proceeding -
6
Intestinal intraepithelial lymphocytes influence the production of somatostatin
Published in Surgery (01-08-1996)“…Background. We have previously demonstrated that intestinal intraepithelial lymphocytes (iIELs) inhibit lymphocyte proliferation. Because somatostatin also…”
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7
A Cohort Analysis of the Use of Health Services by Elderly Americans
Published in Journal of health and social behavior (01-09-1986)“…This paper presents a cohort analysis of the use of health services by elderly Americans. Standard cohort tables are constructed using data on approximately…”
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8
Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications
Published in Applied physics letters (06-07-1998)“…This letter reports an investigation of two unique dual inlaid metallization approaches with low pressure chemical vapor deposition (LPCVD) of aluminum (Al)…”
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9
Factors which determine the orientation of CVD Al films grown on TiN
Published in Solid-state electronics (1999)“…CVD Al deposited on a TiN/Ti liner followed by `warm' PVD Al (Cu) is a promising approach for filling high aspect ratio vias. A highly (111) textured film is…”
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10
Veterans' and Nonveterans' Use of Health Services: A Comparative Analysis
Published in Medical care (01-12-1985)“…This study compares the use of health services by veterans with that by nonveterans; compares the use of health services by veterans from different service…”
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11
The Use of Proxies in Health Surveys: Substantive and Policy Implications
Published in Medical care (01-06-1986)“…It has traditionally been assumed that obtaining health and illness behavior data by proxy on household members who are not present during the actual interview…”
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12
Length of Stay in the VA: Long-Term Care in Short-Term Hospitals
Published in Medical care (01-03-1987)Get full text
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13
Some Clarification about Health Planning in the VA
Published in Medical care (01-11-1987)Get full text
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14
Barrier crystallographic texture control and its impact on copper interconnect reliability
Published in Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) (2002)“…The impacts of barrier micro-structure on Cu seed and electro copper plating (ECP) film have been investigated in terms of seed sheet resistance (R/sub s/)…”
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Conference Proceeding -
15
Prison hospital aids 10,000 convicts
Published in Hospital management (01-02-1953)Get more information
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16
Mass selection for improved cold and density tolerance of two maize populations
Published in Euphytica (01-03-1984)“…Data of planting and plant density are two cultural practices influencing grain yield of maize (Zea mays L.). This study was designed to evaluate the…”
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17
Cu barrier/seed technology development for sub-0.10 micron copper chips
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)“…Advanced PVD technologies have been reviewed for copper barrier-seed applications for different device nodes. Each new device generation requires improved step…”
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Conference Proceeding -
18
Etch/metallization process sequence integration-impact of Al texture on Al etch performance
Published in Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) (1998)“…Very successful process sequence integration has been demonstrated with Al etch/CVD/PVD-Al deposition. For CVD-Al with poor Al(111) texture, Al sidewall attack…”
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Conference Proceeding -
19
Texture and surface morphology improvement of Al by two-stage chemical vapor deposition and its integration in an Al plug-interconnect scheme for sub 0.25 μm metallization
Published in Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films (01-05-1998)“…A two-stage deposition with successive seed and bulk deposition steps was developed to improve the morphology and texture of chemical vapor deposited (CVD)…”
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Conference Proceeding Journal Article -
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Materials Research Society Meeting, Symposium K: Multilevel Metal Process Integration
Published in Thin solid films (1998)Get full text
Conference Proceeding