Search Results - "Morisako, Isamu"

Reliability evaluation of thick Ag wire bonding on Ni pad for power devices by Wei, Xing, Xin, Di, Morisako, Isamu, Takahashi, Junko, Tatsumi, Kohei

Get full text

Improvement in the reliability of crystalline silicon solar cell interconnection by using Nickel Micro-Plating Bonding (NMPB) technology by Yu, Xinguang, Fu, Zhi, Morisako, Isamu, Koshiba, Keiko, Iizuka, Tomonori, Tatsumi, Kohei

“…Abstract It is popular to research promoting the light conversion efficiency of crystalline silicon solar cell photovoltaic (PV) modules. However, excellent…”
Get full text

High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding by Tatsumi, Kohei, Morisako, Isamu, Wada, Keiko, Fukuomori, Minoru, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Hikita, Masayuki, Kamimura, Rikiya, Kawanabe, Naoki, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in…”
Get full text

High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles by Tatsumi, Kohei, Tanaka, Yasunori, Iizuka, Tomonori, Wada, Keiko, Fukumori, Minoru, Morisako, Isamu, Jeongbin, Yoon, Murakawa, Norihiro

“…Recently there are high expectations for incorporating silicon carbide (SiC) devices as power modules in hybrid electric vehicles (HEV) and electric vehicles…”
Get full text

Application of Nickel Micro-Plating Bonding (NMPB) Technology to Crystalline Silicon Solar Cell Interconnection by Yu, Xinguang, Kasahara, Junichi, Hashimoto, Kimikazu, Morisako, Isamu, Shimmi, Toshiharu, Mikami, Nobuhiro, Tatsumi, Kohei

“…The long-term reliability of the interconnection in crystalline silicon solar cell photovoltaic (PV) modules is crucial for ensuring optimal performance for up…”
Get full text

An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes by Fukui, Naoki, Koshiba, Keiko, Miyazaki, Itaru, Morisako, Isamu, Iizuka, Tomonori, Itose, Tomoya, Hikita, Masayuki, Kamimura, Rikiya, Tatsumi, Kohei

“…As for the IGBT power device based on Si used for the vehicle, the performance limit of the Si semiconductor has been pointed out, and the SiC semiconductor…”
Get full text

Development and evaluation of SiC inverter using Ni micro plating bonding power module by Kawagoe, Akihiro, Itose, Tomoya, Imakiire, Akihiro, Kozako, Masahiro, Hikita, Masayuki, Tatsumi, Kohei, Iizuka, Tomonori, Morisako, Isamu, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…This paper reports on evaluation of inverter system using silicon carbide (SiC) power module with a novel packaging technology of Ni micro plating bonding. The…”
Get full text