Search Results - "Morifuji, E."
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1
Supply and threshold-Voltage trends for scaled logic and SRAM MOSFETs
Published in IEEE transactions on electron devices (01-06-2006)“…The authors show new guidelines for V/sub dd/ and threshold voltage (V/sub th/) scaling for both the logic blocks and the high-density SRAM cells from low…”
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2
Power Optimization for SRAM and Its Scaling
Published in IEEE transactions on electron devices (01-04-2007)“…With technology scaling, there is a strong demand for smaller cell size, higher speed, and lower power in SRAMs. In addition, there are severe constraints for…”
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3
Layout Dependence Modeling for 45-nm CMOS With Stress-Enhanced Technique
Published in IEEE transactions on electron devices (01-09-2009)“…Layout dependences for stress-enhanced MOSFETs including contact positioning, the second neighboring poly effect, and bent diffusion are modeled in 45-nm CMOS…”
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4
An accurate and efficient high frequency noise simulation technique for deep submicron MOSFETs
Published in IEEE transactions on electron devices (01-12-2000)“…Based on an active transmission line concept and two-dimensional (2-D) device simulations, an accurate and computationally efficient simulation technique for…”
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5
Study of the manufacturing feasibility of 1.5-nm direct-tunneling gate oxide MOSFETs: uniformity, reliability, and dopant penetration of the gate oxide
Published in IEEE transactions on electron devices (01-03-1998)“…Although direct tunneling gate oxide MOSFETs are expected to be useful in high-performance applications of future large-scale integrated circuits (LSIs), there…”
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6
Cutoff frequency and propagation delay time of 1.5-nm gate oxide CMOS
Published in IEEE transactions on electron devices (01-06-2001)“…The high-frequency AC characteristics of 1.5-nm direct-tunneling gate SiO/sub 2/ CMOS are described. Very high cutoff frequencies of 170 GHz and 235 GHz were…”
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7
New guideline of Vdd and Vth scaling for 65nm technology and beyond
Published in Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004 (2004)“…We show new guideline of Vdd and Vth scaling for logic blocks and high density SRAM cell from low power dissipation viewpoint. New degradation mode for…”
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Conference Proceeding -
8
Ultrathin gate oxide CMOS with nondoped selective epitaxial Si channel layer
Published in IEEE transactions on electron devices (01-06-2001)“…The nondoped selective epitaxial Si channel technique has been applied to ultrathin gate oxide CMOS transistors. It was confirmed that drain current drive and…”
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9
Thermal stability of CoSi/sub 2/ film for CMOS salicide
Published in IEEE transactions on electron devices (01-11-2000)“…We describe the relationship between the sheet resistance of Co-silicided poly-Si and various doping elements. The surface condition of the poly-Si before Co…”
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10
Power Si-MOSFET operating with high efficiency under low supply voltage
Published in IEEE transactions on electron devices (01-12-2000)“…A design method for RF power Si-MOSFETs suitable for low-voltage operation with high power-added efficiency is presented. In our experiments, supply voltages…”
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11
Technology independent degradation of minimum noise figure due to pad parasitics
Published in 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192) (1998)“…In order to investigate the influence of pad parasitics on device noise performance, noise parameters on Si CMOS, GaAs MESFET and GaAs p-HEMT transistors were…”
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Conference Proceeding -
12
Variability aware modeling and characterization in standard cell in 45 nm CMOS with stress enhancement technique
Published in 2008 Symposium on VLSI Technology (01-06-2008)“…Gate density is ultimately increased to 2100 kGates/mm 2 by pushing the critical design rules without increasing the circuit margin in 45 nm technology. Layout…”
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13
High-frequency AC characteristics of 1.5 nm gate oxide MOSFETs
Published in International Electron Devices Meeting. Technical Digest (1996)“…Results of the high-frequency AC characteristics of 1.5 nm direct-tunneling gate oxide MOSFET's were shown for the first time. Very high cutoff frequencies of…”
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14
Electro-Thermally Coupled Power Optimization for Future Transistors and Its Applications
Published in IEEE transactions on electron devices (01-07-2007)“…We report a novel electro-thermally coupled power-optimization methodology for future transistors. The methodology self-consistently yields the globally…”
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15
New guideline for hydrogen treatment in advanced system LSI
Published in 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) (2002)“…In this paper, we focus on hydrogen related processes and its impact on system LSI. Hydrogen affects not only DRAM performance but also reliability…”
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16
Nitrogen-doped nickel monosilicide technique for deep submicron CMOS salicide
Published in Proceedings of International Electron Devices Meeting (1995)“…A nitrogen-doped NiSi technique has been developed for deep submicron CMOS. It was found that the nitrogen suppresses oxidation of the silicide film, resulting…”
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17
New considerations for highly reliable PMOSFETs in 100 nm generation and beyond
Published in 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184) (2001)“…The hot-carrier (HC) instability for surface channel PMOSFETs is investigated intensively. We found from experimental data that hot-carrier injection occurs at…”
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18
A study of hot-carrier degradation in n- and p-MOSFETs with ultra-thin gate oxides in the direct-tunneling regime
Published in International Electron Devices Meeting. IEDM Technical Digest (1997)“…Hot-carrier degradation in the direct-tunneling regime of the gate oxide was investigated under a wide range of conditions such as stress bias, oxide…”
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19
Thermal stability of CoSi2 film for CMOS salicide
Published in IEEE transactions on electron devices (01-11-2000)“…The surface condition of the poly-Si before Co sputtering plays an important role in suppressing the "narrow line effect," in which the silicide sheet…”
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20
A study of flicker noise in n- and p-MOSFETs with ultra-thin gate oxide in the direct-tunneling regime
Published in International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217) (1998)“…Flicker noise characteristics of 1.5 nn direct-tunneling gate oxide n- and pMOSFETs have been investigated It was confirmed that in the shorter gate length…”
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