Search Results - "Moon, T. J."

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  1. 1

    The Externalizing and Internalizing Pathways to Marijuana Use Initiation: Examining the Synergistic Effects of Impulsiveness and Sensation Seeking by Wasserman, Alexander M., Shaw-Meadow, K. J., Moon, T. J., Karns-Wright, T. E., Mathias, C. W., Hill-Kapturczak, N., Dougherty, D. M.

    Published in Developmental psychology (01-12-2021)
    “…Adolescent marijuana use has become increasingly more problematic compared with the past; thus, understanding developmental processes that increase the…”
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    Optical deformability of soft biological dielectrics by Guck, J, Ananthakrishnan, R, Moon, T J, Cunningham, C C, Käs, J

    Published in Physical review letters (05-06-2000)
    “…Two counterpropagating laser beams were used to significantly stretch soft dielectrics such as cells. The deforming forces act on the surface between the…”
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    Flame-retardant Polyamide 11 and 12 Nanocomposites: Processing, Morphology, and Mechanical Properties by Lao, S.C., Yong, W., Nguyen, K., Moon, T.J., Koo, J.H., Pilato, L., Wissler, G.

    Published in Journal of composite materials (01-12-2010)
    “…The objective of this study is to develop improved polyamide (nylon) 11 (PA11) and 12 (PA12) polymers with enhanced flame retardancy, thermal, and mechanical…”
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    Flame-retardant Polyamide 11 and 12 Nanocomposites: Thermal and Flammability Properties by Lao, S.C., Wu, C., Moon, T.J., Koo, J.H., Morgan, A., Pilato, L., Wissler, G.

    Published in Journal of composite materials (01-08-2009)
    “…Polyamide (nylon) 11 (PA11) and 12 (PA12) were melt-blended, dispersing low concentrations of nanoparticles, namely nanoclays (NCs), carbon nanofibers (CNFs),…”
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    Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding by Rezvani, A., Shah, A., Mayer, M., Zhou, Y., Moon, J.T.

    Published in Microelectronics and reliability (01-07-2013)
    “…Cu wire is replacing Au wire in the microelectronic industry due to its lower cost. However, during Cu ball bonding one of the main challenges is the increased…”
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    Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force by Hang, C.J., Song, W.H., Lum, I., Mayer, M., Zhou, Y., Wang, C.Q., Moon, J.T., Persic, J.

    Published in Microelectronic engineering (01-10-2009)
    “…Cu bonding wire is more and more used for interconnections to integrated circuits (ICs) to reduce cost and increase performance compared to Au wire. To…”
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    Investigation of recrystallization and grain growth of copper and gold bonding wires by CHO, Jae-Hyung, ROLLETT, A. D, CHO, J.-S, PARK, Y.-J, MOON, J.-T, OH, K. H

    “…Copper bonding wires were characterized using electron backscatter diffraction (EBSD). During drawing, shear components are mainly located under the surface…”
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    Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding by Pequegnat, A., Hang, C. J., Mayer, M., Zhou, Y., Moon, J. T., Persic, J.

    “…Effects of the electrical flame off (EFO) parameters on the hardness and work hardening properties of Cu free air balls (FABs) are reported and compared to…”
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    Immunostimulatory nanoparticle incorporating two immune agonists for the treatment of pancreatic tumors by Lorkowski, M.E., Atukorale, P.U., Bielecki, P.A., Tong, K.H., Covarrubias, G., Zhang, Y., Loutrianakis, G., Moon, T.J., Santulli, A.R., Becicka, W.M., Karathanasis, E.

    Published in Journal of controlled release (10-02-2021)
    “…Pancreatic ductal adenocarcinoma (PDAC) is a highly malignant disease, where even surgical resection and aggressive chemotherapy produce dismal outcomes…”
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    Perceived Pubertal Timing and Deviant Peer Processes Predicting Substance Use Initiation: The Moderating Role of Impulsiveness by Wasserman, A. M., Karns-Wright, T. E., Mathias, C. W., Moon, T. J., Hill-Kapturczak, N., Dougherty, D. M.

    Published in The Journal of early adolescence (01-06-2024)
    “…The present study aimed to test if perceived pubertal timing was related to marijuana and alcohol use through deviant peer affiliation. Additionally, we…”
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    Recrystallization and grain growth of cold-drawn gold bonding wire by CHO, J.-H, CHO, J.-S, MOON, J.-T, LEE, J, CHO, Y. H, KIM, Y. W, ROLLETT, A. D, OH, K. H

    “…Recrystallization and grain growth of gold bonding wire have been investigated with electron backscatter diffraction (EBSD). The bonding wires were wire-drawn…”
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    Experimental investigation of the impact of LWR on sub-100-nm device performance by Hyun-Woo Kim, Ji-Young Lee, Shin, J., Sang-Gyun Woo, Han-Ku Cho, Joo-Tae Moon

    Published in IEEE transactions on electron devices (01-12-2004)
    “…Argon Fluoride (ArF) lithography is essential to develop a sub-100-nm device, however, line edge roughness (LER) and line width roughness (LWR) is playing a…”
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  14. 14

    Al2O3 coating of ZnO nanorods by atomic layer deposition by MIN, B, LEE, J. S, MOON, J. T, HWANG, J. W, KEEM, K. H, KANG, M. I, CHO, K, SUNG, M. Y, KIM, S, LEE, M.-S, PARK, S. O

    Published in Journal of crystal growth (01-05-2003)
    “…ZnO nanorods were coated conformally with aluminum oxide (Al2O3) material by atomic layer deposition (ALD). The ZnO nanorods were first synthesized on a…”
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    Electrical observations of filamentary conductions for the resistive memory switching in NiO films by Kim, D. C., Seo, S., Ahn, S. E., Suh, D.-S., Lee, M. J., Park, B.-H., Yoo, I. K., Baek, I. G., Kim, H.-J., Yim, E. K., Lee, J. E., Park, S. O., Kim, H. S., Chung, U-In, Moon, J. T., Ryu, B. I.

    Published in Applied physics letters (15-05-2006)
    “…Experimental results on the bistable resistive memory switching in submicron sized NiO memory cells are presented. By using a current-bias method, intermediate…”
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    Low-Stress Thermosonic Copper Ball Bonding by Shah, A., Mayer, M., Zhou, Y.N., Hong, S.J., Moon, J.T.

    “…Thermosonic ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum diameter,…”
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    Improvement of resistive memory switching in NiO using IrO2 by Kim, D. C., Lee, M. J., Ahn, S. E., Seo, S., Park, J. C., Yoo, I. K., Baek, I. G., Kim, H. J., Yim, E. K., Lee, J. E., Park, S. O., Kim, H. S., Chung, U-In, Moon, J. T., Ryu, B. I.

    Published in Applied physics letters (05-06-2006)
    “…For the development of resistive memory devices using NiO, improvements of several memory switching properties are required. In NiO memory cells with noble…”
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    Observation of a Be double-Lambda hypernucleus in the J-PARC E07 experiment by Ekawa, H, Agari, K, Akaishi, T, Akazawa, Y, Ashikaga, S, Bassalleck, B, Bleser, S, Endo, Y, Fujikawa, Y, Fujioka, N, Fujita, M, Goto, R, Han, Y, Hasegawa, S, Hashimoto, T, Hayakawa, S H, Hayakawa, T, Hayata, E, Hicks, K, Hirose, E, Hirose, M, Honda, R, Hoshino, K, Hoshino, S, Hosomi, K, Hwang, S H, Ichikawa, M, Ieiri, M, Imai, K, Inaba, K, Ishikawa, Y, Iskendir, A, Ito, H, Ito, K, Jung, W S, Kanatsuki, S, Kanauchi, H, Kasagi, A, Kawai, T, Kim, M H, Kim, S H, Kinbara, S, Kiuchi, R, Kobayashi, H, Kobayashi, K, Koike, T, Koshikawa, A, Lee, J Y, Lee, J W, Ma, T L, Matsumoto, S Y, Minakawa, M, Miwa, K, Moe, A T, Moon, T J, Moritsu, M, Nagase, Y, Nakada, Y, Nakagawa, M, Nakashima, D, Nakazawa, K, Nanamura, T, Naruki, M, Nyaw, A N L, Ogura, Y, Ohashi, M, Oue, K, Ozawa, S, Pochodzalla, J, Ryu, S Y, Sako, H, Sasaki, Y, Sato, S, Sato, Y, Schupp, F, Shirotori, K, Soe, M M, Soe, M K, Sohn, J Y, Sugimura, H, Suzuki, K N, Takahashi, H, Takahashi, T, Takahashi, Y, Tamura, H, Tanida, K, Theint, A M M, Tint, K T, Toyama, Y, Ukai, M, Umezaki, E, Watabe, T, Watanabe, K, Yamamoto, T O, Yang, S B, Yoon, C S, Yoshida, J, Yoshimoto, M, Zhang, D H, Zhang, Z

    “…Abstract A double-$\Lambda$ hypernucleus, _{\Lambda\Lambda}\mathrm{Be}$, was observed by the J-PARC E07 Collaboration in nuclear emulsions tagged by the…”
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